Lead Package Assembly Integrator

Job Title

Lead Package Assembly Integrator

Role Summary

As the lead assembly process integrator on the Packaging Technology team, you will develop and integrate 3D-stacked photonics package assembly, test, and fiber-attach processes. You will collaborate with design teams, foundries, OSAT partners, and system architects to establish manufacturable package architectures that meet performance and reliability targets.

Work directly on test-chip strategies, design-of-experiments, and reliability analysis to drive high-yield manufacturing for data-center photonics products. Base salary range (USD): $218,000—$317,000; total compensation includes equity and performance-based components.

Experience Level

Senior-level (Lead). Typically requires 7+ years of relevant industry experience in advanced packaging or process development.

Responsibilities

Primary responsibilities include process development, test-chip management, and cross-functional integration:

• Develop end-to-end 3D package assembly, test, and fiber-attach processes to achieve robust yields and meet performance and reliability goals.
• Design and validate package architectures optimized for manufacturability and long-term reliability.
• Define test chip requirements and manage test chip designs for process development.
• Develop and validate assembly and test design rules across backend/RDL, silicon/package interaction, substrate, thermal/mechanical, and fiber attach.
• Plan and execute design of experiments, manage data collection, and perform analysis to understand process-design interactions.
• Analyze reliability risks under product use conditions and drive design/materials solutions to improve mechanical integrity.
• Document methods and results; communicate findings to stakeholders, suppliers, and customers as required.

Requirements

Must-have skills and experience:

• Experience in wafer-scale packaging assembly process development.
• Knowledge of 2D/3D packaging technologies, materials, and associated equipment.
• Proven ability to define requirements for test chips and assembly test vehicles.
• Understanding of photonics packaging requirements, including fiber attach methods.
• Experience with advanced packaging considerations: thermal, mechanical, and reliability factors.
• Ability to plan and analyze design of experiments and manage technical data.
• Ability to work with external foundry and OSAT partners and integrate manufacturability into product definitions.
• Capacity to comply with U.S. export control requirements.

Nice-to-have:

• Experience with thermal/mechanical modeling and coding for data analysis.
• Strong communication skills and history of project ownership.
• Track record of creative problem solving in complex technical challenges.

Education Requirements

MS or PhD in Mechanical Engineering, Materials Science, or a related engineering field.

About the Company

Company: Lightmatter

Headquarters: Boston, Massachusetts, USA

Lightmatter develops photonic AI data-center infrastructure and optical chips for extreme-scale AI and HPC. The company invented the Passage 3D‑stacked photonics engine to provide high-bandwidth, low-latency interconnects across large-scale processors and raised $400M in Series D financing at a reported $4.4B valuation.