Lead Engineer, Package Development

Job Title

Lead Engineer, Package Development

Role Summary

Lead Engineer responsible for taking new semiconductor packages from design to production: defining test strategies, leading validation and driving yield improvement. Works with product development (PD), new product introduction (NPI), manufacturing and suppliers to qualify processes, materials, equipment and tooling.

Operates with a high degree of autonomy and includes technical leadership and supervision of a technical team.

Experience Level

Senior - requires at least 5 years of experience in package development, new product introduction, or sustaining roles in semiconductor assembly environments.

Responsibilities

Key responsibilities include process and material development, equipment qualification, product validation, and yield improvement.

• Define test strategies and lead validation for new packages and products.
• Develop and optimize assembly and molding process parameters; recommend alternative materials and processes to reduce cost and improve manufacturability.
• Perform failure analysis and product characterization (destructive analysis, FA, CSAM, SEM, cross-section) to resolve design and production issues.
• Design, specify and qualify jigs, fixtures and equipment; lead equipment buy-off and supplier site qualifications.
• Create and maintain process documentation, flowcharts, FMEAs, control plans, and work instructions for new package projects.
• Plan and execute yield improvement and cost-reduction projects; collaborate with PD and NPI teams on release strategies.
• Coordinate cross-functional and supplier communication on quality, manufacturability, and reliability issues.
• Train and supervise technical staff; lead continuous improvement activities.

Requirements

Must-have technical skills, tools, and experience.

• Minimum 5 years' experience in package development, NPI, or sustaining in semiconductor assembly for leadframe and substrate-based packages.
• Expertise in mold simulation review and tooling/POD design interpretation and corrective recommendations.
• SME-level experience with failure analysis and reliability assessment tools (CSAM, cross-sectioning, SEM, etc.).
• Strong knowledge of assembly processes (upstream and downstream) and their impact on molding and package quality.
• Applied experience with statistical experimentation and analysis tools (DOE, SAS-JMP, Minitab or similar) to establish and improve process capability.
• Proficient with Advanced Quality Core tools: process flow, FMEA, control plan, process specifications.
• Skilled in problem-solving methodologies and continuous improvement tools (PDCA, Lean); ability to deliver cost-effective solutions.
• High mechanical reasoning, drawing interpretation, and knowledge of dimensioning and tolerancing.
• Effective written and oral communication, presentation, training, and team leadership abilities.

Education Requirements

Degree in Mechanical, Electrical, Electronics & Communication, Materials, Metallurgical, Chemical, Manufacturing, or Industrial Engineering (as listed in the posting). The posting does not state an explicit equivalent-experience alternative.

About the Company

Company: Allegro MicroSystems

Headquarters: Manchester, New Hampshire, USA

Global semiconductor company with over 30 years of innovation, developing semiconductor devices and design enablement tools. Allegro focuses on device development, foundry partnerships, IP characterization, and design automation to support product roadmaps and technology advancement.