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Laser Module Technical Lead

Xscape Photonics
August 27, 2026
Full-time
On-site
Santa Clara, California, United States
Other Semiconductor Jobs, Level - Senior

Job Title

Laser Module Technical Lead

Role Summary

Lead the system architecture, integration, and technical execution of laser modules for high-speed optical communications. Own end-to-end module performance across lasers, PICs, electronics, firmware, packaging, and thermal management to deliver reliable, manufacturable products.

Work cross-functionally and with external suppliers from concept through production transfer and qualification.

Experience Level

Senior / Principal level. Principal-level expectation: 12–15+ years of relevant technical leadership experience.

Responsibilities

Drive module-level design, integration, verification, and transfer to manufacturing.

  • Define module requirements, interface specifications, and performance budgets.
  • Allocate optical, electrical, thermal, and mechanical targets across subsystems.
  • Lead integration of semiconductor lasers (DFB, DBR, ECL, tunable), SOAs, silicon photonic PICs, isolators/filters, fiber interfaces, driver electronics, firmware, and mechanical/thermal solutions.
  • Define and execute characterization plans for power, wavelength, linewidth, SMSR, RIN, polarization, coupling efficiency, and thermal behavior.
  • Troubleshoot system-level optical, electrical, and thermal issues; perform root-cause analysis.
  • Balance performance, manufacturability, reliability, and cost in design tradeoffs.
  • Collaborate with internal teams and external suppliers on component specifications, qualification, and manufacturing readiness.
  • Support product qualification, reliability testing, and transfer to volume manufacturing.

Requirements

Must-have technical skills, domain experience, and leadership track record.

  • Demonstrated technical leadership of cross-functional engineering teams through product development.
  • Deep understanding of semiconductor lasers and laser-module integration.
  • Experience integrating lasers with silicon photonic PICs.
  • Strong knowledge of optical packaging, fiber coupling, alignment, and assembly processes.
  • Experience with laser control electronics, TEC control, and monitoring photodiodes.
  • Familiarity with optical communication systems and module-level performance metrics.
  • Proven system-level debugging and root-cause analysis skills for optical, electrical, and thermal issues.
  • Experience collaborating with suppliers on specifications, qualification, and manufacturing readiness; supporting qualification and reliability testing.
  • Principal-level candidates should demonstrate 12–15+ years of relevant experience and clear technical ownership history.

Nice-to-have / preferred:

  • Experience with external-cavity and narrow-linewidth lasers, high-speed transmit engines, co-packaged optics, or 400G–1.6T modules.
  • Familiarity with passive and active alignment techniques, automated manufacturing, production test development, and failure analysis.

Education Requirements

MS or PhD in Photonics, Optical Engineering, Electrical Engineering, Physics, or a related technical field.


About the Company

Company: Xscape Photonics

Headquarters: Santa Clara, California, United States

Developer of integrated photonics solutions and instrumentation, specializing in photonic circuits, control systems, and test methodologies for optical communication and sensing applications. Works on device integration, control algorithms, and validation of photonic hardware and firmware.

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Date Posted: 2026-08-27