Internship Process and Material Analysis
Internship within the Product Diagnostic and Quality Center (Package Analysis team) performing material- and package-level analysis to support failure analysis, sample preparation, and test activities. The role supports laboratory experiments, documentation, and presentation of results to engineering and process teams.
Work closely with engineers across package/front-end innovation, fabrication and assembly/test sites; tasks and scope will be adapted to the intern's education level.
Entry-level internship. Suitable for undergraduate (BSc) or master's (MSc) students; no prior years-of-experience required.
Primary tasks during the internship include hands-on laboratory work, experiment design and reporting.
Minimum competencies and attributes for success in this internship.
Studying Material Sciences or related fields such as Analytical, Molecular or Physical Chemistry at BSc or MSc level. Equivalent technical study or practical experience in a related field may be acceptable. (The internship content and responsibilities will be adapted to the candidate's education level.)
Company: NXP Semiconductors
Headquarters: Nijmegen, Netherlands
NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.
