Intern - YE Physical Failure Analysis Engineer
This is a summer internship within Technology Development Yield Enhancement (YE) focused on Physical Failure Analysis (PFA). The intern will be assigned a project to develop practical problem‑solving skills, learn failure analysis techniques, and support yield improvement activities in fabrication environments.
The role provides hands‑on exposure to semiconductor failure analysis tools and processes and aims to build understanding of device operation and process interactions.
Entry-level (Intern). Targeted at undergraduate students (first year to junior-level coursework) or students graduating by spring 2027.
Core responsibilities expected during the internship:
Must-have skills and attributes for successful performance:
Nice-to-have:
Enrollment in a 4-year Bachelor's program (first year to junior-level coursework, or graduating by spring 2027). Preferred majors: Electrical Engineering, Electronics Engineering, Materials Science and Engineering, Physics, Chemistry, or Chemical Engineering.
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
