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Intern - Process Integration, Advanced Packaging

Micron Technology
November 5, 2026
Internship
On-site
Boise, Idaho, United States
Process Engineering Jobs, Level - Entry or Early Career

Job Title

Intern - Process Integration, Advanced Packaging

Role Summary

Work with Micron's Wafer Level Packaging Technologies Team in Boise to support development and integration of advanced interconnect and packaging processes. The intern will perform hands-on experiments, data analysis, line monitoring, and contribute to yield improvement and process optimization.

Experience Level

Entry-level internship for current undergraduate or graduate students; suitable for those seeking practical semiconductor process experience.

Responsibilities

Key duties include experimental work, data-driven analysis, and cross-team communication.

  • Lead structured problem-solving activities (e.g., Kepner-Tregoe).
  • Design and implement Design of Experiments (DoE) for process development.
  • Execute experiments on Micron equipment and document results.
  • Analyze experimental data and provide clear, actionable recommendations.
  • Support line monitoring, yield improvement projects, and related project management tasks.
  • Develop new line monitoring methods and define critical metrics.
  • Communicate findings to local and global partners and present results to stakeholders.
  • Apply AI tools, workflows, and agents to accelerate learning and analysis.

Requirements

Minimum qualifications focus on analytical, collaborative, and execution capabilities. Preferred qualifications list relevant domain experience and tools.

  • Must-have: Strong data extraction, analysis, and reporting skills (e.g., JMP, system analytics).
  • Must-have: Effective collaboration and communication across multi-functional teams.
  • Must-have: Ability to prioritize multiple complex tasks and adapt to changing responsibilities.
  • Must-have: Initiative, flexibility, and tenacity to work under tight timelines with limited resources.
  • Must-have: Proficiency in using AI tools and workflows for analysis and learning.

Preferred / Nice-to-have:

  • Experience with semiconductor process integration or packaging technologies.
  • Familiarity with structured problem-solving and decision-making frameworks.
  • Exposure to experimental design and statistical analysis tools.
  • Interest in advanced packaging and interconnect development.

Education Requirements

Currently pursuing a Bachelor's or Master's degree with expected graduation no earlier than Fall 2027.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-11-02