Intern - Next-Gen HBM Platform Architecture

Job Title

Intern - Next-Gen HBM Platform Architecture

Role Summary

The HBM Platform Architecture team defines electrical, thermal, and power-delivery architectures for next-generation High Bandwidth Memory (HBM) solutions. The team works with architecture, design, packaging, and technology groups to optimize signaling, power integrity, thermal management, and system-level performance.

This internship contributes to evaluating architectures for advanced memory systems through modeling, analysis, and tool development to improve performance, power efficiency, reliability, and scalability.

Experience Level

Entry-level (Intern). Guidance: 0–2 years of relevant experience through internships, research projects, coursework, or academic projects.

Responsibilities

Primary technical tasks and collaboration expectations.

• Perform signaling and timing analysis for on-die and off-die interfaces across system and packaging topologies.
• Develop and evaluate thermal models to analyze heat transfer and thermal performance in advanced memory systems.
• Analyze power delivery networks (IR-drop, electromigration, power integrity) and support PDN optimization for HBM architectures.
• Develop modeling, simulation, and automation tools to support power delivery, thermal analysis, and architecture evaluation.
• Collaborate with architecture, design, packaging, and technology teams to evaluate system-level trade-offs and support technology development.

Requirements

Must-have technical skills and experience; nice-to-have items follow.

• Coursework or project experience in analog design, I/O design, signaling, DRAM technologies, high-speed interfaces, packaging, or 2.5D/3D integration.
• Understanding of electrical systems, signal integrity, power delivery, circuit analysis, or semiconductor design fundamentals.
• Ability to read and interpret technical specifications, datasheets, interface standards, and hardware documentation.
• Strong analytical, problem-solving, and technical communication skills.
• Experience using AI-enabled tools and large language models (e.g., Copilot, Claude, ChatGPT) as part of engineering workflows, and ability to validate AI-generated outputs.

Nice-to-have:

• Familiarity with Cadence EDA tools, MATLAB, thermal analysis tools, or signal integrity tools.
• Knowledge of semiconductor packaging, assembly, heterogeneous integration, or advanced packaging technologies.
• Experience with thermal modeling, computational analysis, IR-drop, electromigration, or power integrity evaluations.
• Experience developing automation, simulation environments, or data analysis workflows using Python or similar languages.
• Knowledge of HBM, DRAM, memory interfaces, and high-speed signaling technologies.

Education Requirements

Currently pursuing a Bachelor’s, Master’s, or PhD in Electrical Engineering, Electronics Engineering, Computer Engineering, Computer Science, or a related technical field. Academic coursework, internships, or research projects in relevant areas are acceptable.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.