Intern - HIG HBM PSE PACKAGE PE

Job Title

Intern - HIG HBM PSE PACKAGE PE

Role Summary

This is a supervised, full-time engineering internship within the Heterogeneous Integration Group, High Bandwidth Memory Product System Engineering team at Fab 10A, Singapore. The intern will develop a structured High Bandwidth Memory (HBM) defect library and an interactive analytics dashboard to document, visualize, and analyze electrical and physical defect signatures.

Work includes data organization, Python-based analytics, dashboard development, and evaluation of AI-enabled methods for defect categorization and knowledge retrieval.

Experience Level

Entry-level internship. The role is intended for students or recent graduates; no specific years of prior professional experience required. Candidates must be available full time for at least six months.

Responsibilities

The intern will complete a project under technical guidance. Key responsibilities include:

• Study electrical and physical signatures of selected semiconductor defect modes across process stages and test flows.
• Organize engineering and failure analysis data into a structured, searchable defect knowledge repository.
• Design and implement an interactive dashboard for visualization, tracking, filtering, and analysis of defect information.
• Apply Python, statistical methods, and data analytics to examine relationships between physical defect characteristics and electrical test results.
• Evaluate AI-enabled approaches (generative AI, AI assistants, agentic solutions, LLM-based tools) for defect categorization, information retrieval, and knowledge management.
• Produce deliverables: a documented defect library, dashboard, categorization framework, technical report, and a final presentation demonstrating results and recommendations.

Requirements

Must-have technical skills and project commitments:

• Proficiency in Python and experience with data processing and statistical analysis.
• Experience with data visualization and dashboard development tools or libraries.
• Familiarity with database concepts, data management, or knowledge-management methods.
• Strong analytical, critical-thinking, and problem-solving skills; ability to organize and interpret complex technical information.
• Interest in AI tools and workflows and ability to evaluate AI/LLM solutions for engineering use cases.
• Availability for a full-time internship of at least six months.

Education Requirements

Degree-level foundation expected. The posting specifically references bachelor's- or master's-level study in electrical engineering, materials science and engineering, semiconductor technology and operations, physics, data science (with semiconductor applications), or related engineering/science disciplines. The posting also indicates the ideal candidate may be pursuing a master’s degree. Equivalent education-related preparation in a relevant technical field is implied.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.