Intern - Design Engineer, HBM

Job Title

Intern - Design Engineer, HBM

Role Summary

Intern in Micron's DRAM and Emerging Memory Group (DEG) supporting High Bandwidth Memory (HBM) products. The role focuses on designing, analyzing, and optimizing digital, analog, and memory circuits to meet performance, manufacturability, and reliability goals.

The intern will work with global design, verification, layout, and product teams and use AI-assisted tools and data-driven workflows to accelerate design analysis and engineering productivity.

Experience Level

Entry-level / Internship. Intended for students currently pursuing a Bachelor's degree in a relevant technical discipline.

Responsibilities

Primary engineering tasks and cross-functional collaboration expected during the internship.

• Design, analyze, and optimize memory, logic, and analog circuits for HBM products, supporting layout, validation, and tape-out activities.
• Perform circuit verification, parasitic modeling, and design simulations using industry-standard tools to verify performance and reliability targets.
• Collaborate with layout, CAD, modeling, verification, and multi-functional engineering teams on floor planning, routing, manufacturability, and quality objectives.
• Coordinate with Product Engineering, Test, Probe, Process Integration, and Assembly teams to support product development and production ramps.
• Use AI-assisted tools and data-driven methods to improve design efficiency and accelerate analysis.

Requirements

Technical skills and experience expected for successful contribution during the internship.

• Must-have: Working knowledge of CMOS circuit design fundamentals and semiconductor device physics.
• Must-have: Experience with schematic entry and circuit simulation tools (examples: FineSim, HSPICE).
• Must-have: Familiarity with Verilog modeling and simulation environments, power network analysis, and state machine logic.
• Must-have: Experience with scripting languages such as Python, TCL, or Perl and strong analytical problem-solving skills.
• Nice-to-have: Knowledge of DRAM architecture, memory design concepts, SoC/IO interfaces, or prior exposure to test/probe/process integration.
• Nice-to-have: Experience communicating technical concepts in presentations and working in fast-paced collaborative teams.
• Nice-to-have: Experience using AI agents, generative AI, or AI-assisted engineering tools to support design and workflow optimization.

Education Requirements

Pursuing a Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.