Intern - Advanced Packaging TD
Micron TechnologyJob Title
Intern - Advanced Packaging TD
Role Summary
The Advanced Package Technology Development (TD) intern will support development of interconnect and packaging technologies (hybrid bonding, micro bump, TSV, thermal management). The role involves hands-on experiments, data analysis, process monitoring, and applying AI-assisted tools to improve process performance and yield.
Experience Level
Entry-level internship for enrolled graduate students (Master's or PhD).
Responsibilities
Typical responsibilities include:
- Lead structured problem-solving using methodologies such as Kepner-Tregoe to address process and yield challenges.
- Define, execute, and analyze Design of Experiments (DoE) for advanced packaging and interconnect process development.
- Analyze process, line-monitoring, and yield data; develop monitoring methods and critical metrics to support optimization.
- Present technical findings and collaborate with engineering teams across sites and functions.
- Apply AI and Code Assist to develop Agent-based solutions that enhance data analysis, engineering workflows, or process monitoring.
Requirements
Must-have skills and abilities:
- Experience with data extraction, statistical analysis, and technical reporting using JMP or comparable analytics tools.
- Demonstrated ability to collaborate and communicate technical findings across multifunctional teams.
- Ability to prioritize multiple technical projects and deliver results within project timelines and resource constraints.
- Experience using AI, Code Assist, or Agent-based solutions for technical analysis or engineering workflows.
Nice-to-have:
- Experience with semiconductor process technologies (advanced packaging, BEOL, advanced interconnect, hybrid bonding, micro bump technology, or TSV).
- Experience with structured problem-solving or decision-making methodologies such as Kepner-Tregoe.
- Experience designing experiments and performing statistical analysis using DoE and JMP or comparable tools.
- Academic, research, or project experience related to advanced packaging, interconnect technologies, or thermal management.
Education Requirements
Currently enrolled in an accredited Master’s or PhD program in a semiconductor-related field (e.g., electrical engineering, materials science, applied physics, or similar). Expected graduation no earlier than Fall 2027 and no later than Summer 2028. Academic or research experience in advanced packaging or interconnect technologies is preferred.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
