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Interface Design Architect, HBM - DMTS

Micron Technology
October 2, 2026
Full-time
On-site
Richardson, Texas, United States
Semiconductor IP Jobs, Level - Senior

Job Title

Interface Design Architect, HBM - DMTS

Role Summary

Senior technical lead responsible for architecting, delivering, and validating HBM interface IP and subsystems across architecture, RTL, analog/mixed-signal, verification, tape-out, and silicon bring-up for advanced heterogeneous systems.

The role partners with package, interposer, signal/power integrity, physical design, foundries, IP providers, and customers to implement high-performance, manufacturable die-to-die and memory interfaces for AI/ML and HPC workloads.

Experience Level

Senior level. The posting specifies 18+ years of relevant experience in HBM/DDR/advanced memory, high-speed PHY, mixed-signal, SoC, or ASIC design roles.

Responsibilities

Accountable for end-to-end architecture, implementation, verification, and production readiness of high-speed memory interfaces and related subsystems.

  • Own HBM IO blocks and subsystem delivery from architecture through RTL/circuit implementation, verification, tape-out, silicon bring-up, and post-silicon debug.
  • Define PHY, controller-to-PHY, die-to-die, clocking, training, calibration, power-management, error-handling, and test requirements.
  • Balance trade-offs among bandwidth, latency, power, area, reliability, signal quality, yield, and manufacturability.
  • Lead analog, mixed-signal, and digital interface architecture and design for high-speed memory subsystems.
  • Coordinate with package, interposer, physical design, SI/PI, thermal, and test teams for 2.5D/3D systems.
  • Lead root-cause analysis for complex pre- and post-silicon issues across design, process, package, and system interactions.
  • Serve as technical project lead, defining priorities, specs, execution plans, risks, dependencies, and schedule impacts.
  • Mentor engineers, improve build methods, and drive IP reuse and execution rigor.

Requirements

Must-have:

  • 18+ years of experience in HBM, DDR, LPDDR, advanced memory, high-speed PHY, mixed-signal, SoC, or ASIC design.
  • Proven track record delivering complex interface IP or subsystems from architecture through silicon bring-up and post-silicon debug.
  • Strong expertise in high-speed memory-interface architecture and design, preferably including HBM.
  • Extensive experience in analog and mixed-signal circuit design, digital microarchitecture, RTL design, clocking, training, calibration, power management, and error handling.
  • Experience with front-end implementation and verification: synthesis, static timing analysis, logic equivalence, and RTL debug.
  • Demonstrated technical project leadership across multidisciplinary and multi-site engineering teams.
  • Deep knowledge of DRAM operation, HBM/DDR interfaces, JEDEC specifications, memory subsystems, and high-speed interfaces.

Preferred / Nice-to-have:

  • Hands-on experience architecting or developing HBM, DDR, or LPDDR PHYs and controller subsystems.
  • Experience with CPO architectures, silicon-photonics integration, optical-engine electrical interfaces, or high-speed SerDes.
  • Experience with UCIe or other die-to-die interfaces and chiplet-based architectures.
  • Transistor-level design and analog simulation tool experience (FastSPICE, HSPICE, or similar).
  • Digital design experience using Verilog/SystemVerilog or similar RTL methodologies.
  • Exposure to 2.5D/3D packaging, TSVs, microbumps, hybrid bonding, and interposers.
  • Signal integrity, power integrity, package electrical design, and high-speed channel analysis experience.
  • Contributions to standards bodies (JEDEC, DFI, UCIe Consortium, OIF) or patents/technical publications.

Education Requirements

Bachelor's degree or higher in Electrical Engineering, Computer Engineering, or a related field.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-09-30