IC SoC Product & Subsystem Architect

Job Title

IC SoC Product & Subsystem Architect

Role Summary

Member of the Advanced Chip Engineering (ACE) Microprocessor SoC Implementation R&D team responsible for end-to-end IC/SoC implementation for automotive and industrial processor products. The role is based in Hamburg and focuses on subsystem and top-level SoC architecture for radar and radio infotainment products, coordinating with global design, verification, DFT and physical design teams.

Primary mission: define subsystem/IP and SoC architectures, lead technical implementation, and support pre- and post-silicon verification and validation.

Experience Level

Level: Mid-level. Requires approximately 5–10 years of industry experience with at least 2 years in hardware architecture design for system-on-chip or embedded systems.

Responsibilities

Key responsibilities include:

• Define architecture and specifications for subsystems, IP components, and top-level SoC products, including hardware building blocks, requirements and interfaces.
• Develop digital signal processing algorithms and corresponding hardware IP (Verilog/VHDL).
• Estimate and optimize area and power for implementations.
• Support FPGA bring-up, pre-silicon verification and post-silicon validation activities.
• Provide technical leadership to hardware developers and resolve complex technical issues during product development.
• Perform RTL design, implementation and integration of IPs and subsystems.
• Perform quality checks using EDA tools and participate in research and feasibility studies to define product roadmaps.
• Support innovation projects and test-chip development and collaborate closely with cross-site teams (Verification, Design, DFT, Physical Design).
• Develop and use IA/ML agents to improve flows and methodologies.
• Work under potential security and certification constraints where applicable.

Requirements

Core technical and professional requirements. Education items are listed in the Education Requirements section below.

• Must-have: Advanced knowledge of digital circuit design, including FPGA design and verification; in-depth digital signal processing expertise; hands-on experience with RTL (Verilog/VHDL) design and IP integration.
• Must-have: Practical experience with requirements engineering and semiconductor industry processes and technologies; basic familiarity with RFCMOS circuit design.
• Must-have: Experience with automation using programming and scripting languages to improve flows and efficiency; fluent written and verbal English.
• Must-have: Basic knowledge of embedded compute cores (e.g., Arm Cortex) and digital signal/vector processor cores.
• Must-have: Awareness of automotive safety procedures and capability to work on security-related tasks.
• Desirable: Strong team leadership and communication skills; experience leading hardware teams and coordinating across international teams.
• Desirable: Prior involvement in innovation projects, test-chip development or system-on-chip architect roles.

Education Requirements

Master of Science (MSc) in Electrical Engineering or Electronics Engineering specified in the posting. The listing also references industry experience expectations (5–10 years) and 2+ years in hardware architecture design, but degree requirement specifically: Master of Science in Electrical or Electronics Engineering.

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.