IC Packaging Integration Engineer

Job Title

IC Packaging Integration Engineer

Role Summary

Responsible for IC packaging development and SoC package integration. Lead architecture and integration efforts across cross-functional internal teams and external suppliers to deliver advanced package solutions that meet electrical, mechanical, thermal, and reliability requirements.

Experience Level

Senior-level. The posting specifies a minimum of BS + 10+ years of relevant industry experience; MS/PhD with 6+ years is listed as preferred.

Responsibilities

Lead technical and program activities for IC packaging and integration across internal teams and external suppliers.

• Define package architecture and deliver optimized solutions to meet electrical, mechanical, thermal, and reliability targets.
• Lead SoC package integration and drive the package definition process with cross-functional domains.
• Define and execute test vehicles with foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM).
• Plan and perform DOE and statistical analyses to establish robust NPI build plans for OSATs.
• Lead failure analysis and root-cause investigations across wafer-level processes, assembly, and substrate; drive corrective actions and resolution.
• Apply AI/ML and data-analytics techniques to foundry and OSAT datasets to generate actionable insights for process optimization and yield improvement.
• Review schematics, package and PCB layouts (Allegro), and provide integration feedback to design and manufacturing teams.

Requirements

Key technical skills and experience required or preferred. Educational degree details are listed under Education Requirements below.

• Must-have: 10+ years of relevant industry experience in semiconductor packaging or system integration.
• Must-have: Hands-on experience with advanced packaging technologies (FOWLP, 2.5D, 3D) and high-density/high-performance interconnects.
• Must-have: Strong problem-solving skills with solid fundamentals; experience across thermal, mechanical, SI/PI, materials, reliability, testing, and failure analysis.
• Must-have: Proven experience defining and executing test vehicles and working effectively with foundries and OSAT suppliers.
• Must-have: Experience applying DOE and statistical methods during NPI.
• Must-have: Effective communication skills for collaborating with cross-functional teams and overseas suppliers; ability to review Allegro layouts.
• Nice-to-have: Experience applying AI/ML or advanced data analytics to manufacturing/foundry datasets.
• Nice-to-have: Specialist knowledge in package-system integration and component/system-level reliability.

Education Requirements

Minimum: Bachelor's degree (BS) required. Preferred: MS or PhD. The posting references domain expertise in semiconductor packaging and system integration and notes "strong physics and fundamentals," but does not mandate a specific field of study; relevant technical degrees or equivalent industry experience are expected.

About the Company

Company: Apple

Headquarters: Cupertino, California, United States

Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.