IC Packaging Engineer - WLP
AppleJob Title
IC Packaging Engineer - WLP
Role Summary
Design and drive IC package architecture and integration for SoC and advanced 2.5D/3D packaging projects. Lead packaging technology development from concept through high-volume manufacturing while partnering with design, test, reliability, product teams, and external suppliers.
Experience Level
Senior level — role expects experienced engineers; posting requests 10+ years of relevant industry experience or equivalent.
Responsibilities
Primary technical and cross-functional responsibilities include:
- Lead packaging technology development, including advanced 2.5D and 3D solutions.
- Own SoC package integration end-to-end and coordinate multifunctional teams across design, test, reliability, and product.
- Drive package architecture, material selection, and integration innovation.
- Partner with foundry and OSAT suppliers to take concepts to manufacturing-ready solutions and high-volume manufacturing.
- Lead DOEs, characterization, modeling, and build execution with external partners.
- Serve as technical anchor across teams and influence specifications, materials, and reliability standards.
- Travel internationally as needed (~5%).
Requirements
Must-have technical skills and experience; preferred items are listed separately.
- 10+ years of relevant semiconductor packaging industry experience or equivalent practical experience.
- Deep practical experience taking packages from concept to high-volume manufacturing.
- Established expertise in wafer-level packaging (WLP), 2.5D, and 3D packaging technologies and assembly processes.
- Strong knowledge of materials characterization, reliability standards, and failure analysis techniques.
- Experience with package design tools (e.g., APD, Virtuoso, or equivalents).
- Proven ability to lead complex, multi-team projects and work independently with minimal supervision.
- Excellent cross-functional communication and supplier partnership skills, including experience with overseas suppliers.
Education Requirements
Minimum: Bachelor of Science (BS) in a relevant technical field with 10+ years of industry experience or equivalent practical experience. Preferred: MS or PhD in a relevant discipline (semiconductor packaging, materials, thermal/mechanical/electrical modeling, or related fields).
About the Company
Company: Apple
Headquarters: Cupertino, California, United States
Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.
