IC Package Design Engineer
AppleJob Title
IC Package Design Engineer
Role Summary
The Package Design Engineer will lead physical design and integration of advanced semiconductor packages (SoC, memory, RF, cellular) from concept through tape-out. The role partners with chip, system, manufacturing and product teams to deliver optimized signal and power integrity, manufacturability, and scalable package architectures.
Expectations include driving design methodology improvements, automation, and use of AI tools to improve design efficiency and quality.
Experience Level
Senior-level: 10+ years of relevant industry experience.
Responsibilities
Key responsibilities include owning package physical design and verification and coordinating cross-functional package/system integration.
- Perform physical layout of package substrates for SoC, memory, RF, and cellular ICs.
- Execute parasitic extraction (RLGC) and S-parameter modeling to validate SI/PI performance.
- Own package/SiP/module physical design from concept through tape-out.
- Lead cross-functional collaboration on package feasibility and system co-optimization (chip floorplan, package configuration, electrical performance).
- Drive design methodology improvements by evaluating CAD tools and developing automated design and verification flows.
- Apply AI and automation to improve design efficiency, quality, and performance.
Requirements
Must-have technical skills and experience, followed by preferred skills.
- Must-have: Proven track record in IC package physical design and delivering production tape-outs.
- Must-have: Experience with Cadence Allegro or Mentor Xpedition (or equivalent PCB/package layout tools).
- Must-have: Deep knowledge of signal and power integrity (SI/PI) analysis and parasitic extraction techniques (RLGC, S-parameters).
- Must-have: Strong cross-functional collaboration skills with chip, system, and product teams.
- Must-have: Familiarity with Unix/Linux environments and scripting for automation (Python, Perl, TCL).
- Nice-to-have: Experience with HFSS, PowerSI, or similar EM/PI simulation tools.
- Nice-to-have: Experience with verification tools such as Calibre or CAM350.
- Nice-to-have: Knowledge of substrate manufacturing processes, DRC/DFM rules, and advanced package/assembly technologies (SiP, PoP, wirebond).
Education Requirements
BS (Bachelor's degree) is required; the posting specifies 10+ years of relevant industry experience. No specific field of study or alternative certification was listed.
About the Company
Company: Apple
Headquarters: Cupertino, California, United States
Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.
