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IC Package Design Engineer

Apple
May 05, 2026
Full-time
On-site
Austin, Texas, United States
Physical Design Jobs, Level - Senior

Job Title

IC Package Design Engineer

Role Summary

The IC Package Design Engineer leads physical design and integration of advanced semiconductor packages (SoC, memory, RF, cellular) for Apple's packaging team. The role drives package architecture, optimizes package/SiP/module physical design from concept through tape-out, and collaborates with chip, system, and product teams to meet SI/PI and manufacturing targets.

Experience Level

Senior-level. No specific years of experience were stated in the posting.

Responsibilities

Key responsibilities include leading package architecture and implementing physical designs that meet electrical and manufacturing requirements.

  • Perform physical layout of package substrates for SoC, memory, RF, and cellular ICs.
  • Execute parasitic extraction (RLGC) and S-parameter modeling to validate signal and power integrity (SI/PI) performance.
  • Collaborate cross-functionally with Product Design, System Architecture, and Silicon/SIPI teams on floorplan, package configuration, and electrical performance.
  • Drive package feasibility studies and system co-optimization.
  • Evaluate CAD tools and develop automated design and verification flows to improve efficiency and streamline releases.
  • Leverage AI and automation tools to enhance design efficiency, quality, and performance.

Requirements

The posting specifies an academic minimum (see Education Requirements). The technical and tool experience below was listed as preferred.

  • Preferred: Experience with IC package physical design tools such as Cadence Allegro or Mentor Xpedition.
  • Preferred: Familiarity with verification tools (Calibre, CAM350) and parasitic extraction workflows (RLGC, S-parameters).
  • Preferred: SI/PI analysis experience and simulation tools such as HFSS or PowerSI; knowledge of high-speed layout constraints (e.g., DDR, PCIe).
  • Preferred: Understanding of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM), and package assembly technologies.
  • Preferred: Automation and scripting skills (Python, Perl, TCL) and comfort in a Unix/Linux environment.

Education Requirements

Bachelor's degree required. No specific field of study, certifications, or explicit equivalent-experience language were stated in the posting.


About the Company

Company: Apple

Headquarters: Cupertino, California, United States

Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.

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Date Posted: 2026-05-05