IC Design Engineer

Job Title

IC Design Engineer

Role Summary

Join the IC Solutions Logic development team to implement technical requirements for logic and switch family products. You will work on chip design, top-level layout and verification for high-volume integrated circuits and plastic packages.

The role contributes across concept, design, validation and qualification phases in a cross-functional team (design, product engineering, test engineering and product quality) and owns top-level implementation fit for required packages.

Experience Level

Entry-level (0–3 years). Suitable for candidates with initial hands-on IC design experience and familiarity with analog/mixed-signal EDA tools.

Responsibilities

Deliver cost-effective, datasheet-compliant IC products and drive chip implementation and verification.

• Design integrated circuits using CMOS and BCD wafer processes (typical feature sizes 0.5µm to 0.18µm).
• Develop master designs and derivative functions that share pin functionality and packages.
• Perform block-level and top-level design, optimization and simulations using Synopsys or Cadence tools.
• Conduct top-level functional simulations and statistical verification of building blocks and datasheet parameters.
• Floor-planning, block layout and top-level layout and wiring diagram creation; ensure layouts fit required packages.
• Implement and verify ESD protection and related mechanisms at block and chip level.
• Collaborate with product managers to set specifications and agree verification plans.
• Work with Front End and Back End technology teams and package engineers during development.

Requirements

Core technical skills and professional behaviors required for the role.

Must-have

• Practical experience in circuit design and analog EDA simulation techniques (entry-level acceptable).
• Working knowledge of Cadence or Synopsys tool flows for design and verification.
• Understanding of semiconductor device physics and device characteristics.
• Familiarity with standard CMOS technology and basic ESD mechanisms and protection techniques.
• Analytical problem-solving skills and pragmatic engineering approach.
• Good written and spoken English; effective team collaboration and independent working skills.

Nice-to-have

• Experience with BCD processes and design for plastic package integration.
• Experience in floor-planning, top-level layout ownership and area optimization techniques.
• Prior work on high-volume product development, datasheet parameter verification or packaging constraints.

Education Requirements

Master's degree in Electrical Engineering.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.