HSIO ATE Test Development and Characterization Engineer

Role Summary

This position is within the Post Silicon Engineering group at Qualcomm, focusing on developing test solutions for System on Chips (SoCs). The engineer will be responsible for characterization and cost-effective manufacturing test solutions for HSIO (SERDES) for leading-edge SoC products.

Experience Level

Mid-level: 3-5 years of experience in Hardware Engineering or related areas.

Responsibilities

The engineer will be tasked with the following:

• Define and execute test methodologies for High Speed SERDES Interfaces.
• Develop characterization and test plans, identifying DFT and test hardware requirements.
• Drive first silicon debug and perform technical data analysis of parametric performance.
• Conduct failure analysis and analyze high volume manufacturing yields.
• Work collaboratively with cross-functional teams in a fast-paced environment.

Requirements

Must-have qualifications include:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering or related field.
• Knowledge of VLSI, CMOS analog, and digital semiconductor physics.
• Understanding of HSIO PHY testing and ASIC device level characterization skills.
• Good programming skills in C/C++/Java/Perl.
• Strong problem-solving and debugging skills.

Nice-to-have qualifications include:

• Master's Degree in Electrical or Computer Engineering.
• Knowledge of Advantest 93K test platform and signal integrity.
• Experience in test automation development and debugging.

Education Requirements

Bachelor's degree in a relevant engineering field; Master's degree preferred.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.