Head of Product Development Engineering

Job Title

Head of Product Development Engineering

Role Summary

Lead and execute product development from NPI (new product introduction) through high-volume manufacturing (HVM) for high-speed Ethernet switch and PHY products. This is a hands-on engineering leadership role bridging architecture, design, software/firmware, test, and manufacturing to deliver automotive-grade silicon at scale.

Experience Level

Senior — requires extensive leadership and hands-on experience (typical expectation: 12+ years) in fabless semiconductor product development and high-volume manufacturing.

Responsibilities

Own technical execution and delivery across pre-silicon and post-silicon phases; drive manufacturing readiness, test strategy and productization for high-speed networking ICs.

• End-to-end product test and hardware ownership from pre-silicon to post-silicon; coordinate with Arch, Design, SW/FW, DFT, System, Test (ATE/BI/SLT) and Q&R teams.
• Execute NPI bring-up for Ethernet switch and PHY products; ensure signal integrity, power/performance, and manufacturability at scale.
• Drive manufacturing flow from wafer starts to sample delivery; own wafer test, final test and system-level test strategy.
• Lead characterization, ATE-to-system correlation, productization and manufacturing specifications (including transistor-to-PMIC, part-to-part, aging, and GRR).
• Improve yield across process, package and test; reduce test time and cost while meeting automotive quality requirements.
• Ensure compliance with automotive processes and launch requirements (e.g., Safe launch, PPAP).
• Prepare pre-silicon readiness reviews and enable seamless post-silicon bring-up.

Requirements

Must-have technical skills and operational experience for the role; listed items are required unless noted as nice-to-have.

• 12+ years in fabless semiconductor operations for complex, high-performance SoCs or networking ICs.
• Direct experience with ATE and SLT testing, characterization, ATE-to-system correlation, productization and silicon/package qualification.
• Direct experience working with foundries, assembly houses, test houses and OSATs to develop high-volume products from NPI through HVM.
• Expertise with iJTAG, scan, MBIST; ATE testing of sensors, SerDes, LSIO/HSIO; bare-metal and functional DVFS and benchmark testing at SLT; security fusing.
• Experience productizing high-speed communications chips using ATE and system characterization data while balancing power, performance and yield (PPY).
• Familiarity with automotive electronics ecosystem requirements including IATF 16949 and ISO 26262.
• Technical leadership: experience with yield management systems, statistical data analysis and scripting tools (experience with JMP is expected).
• Proven ability to operate in a fast-paced startup environment and collaborate across cross-functional teams.

Nice-to-have:

• Familiarity with recent FinFET process nodes and QFN / LGA / BGA assembly for automotive products.
• Experience delivering high-speed SerDes products to Tier‑1 automotive OEMs.
• Prior experience managing contractors and building engineering teams.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering or a related technical field (as stated in the posting).

About the Company

Company: Ethernovia

Develops advanced automotive communication semiconductors and systems, focusing on digital SoC design and verification for networking, video, DSP and related IP. Startup-stage employer offering pre-IPO stock options and benefits.