HBM SI/PI Senior Engineer

Job Title

HBM SI/PI Senior Engineer

Role Summary

Join the Heterogeneous Integration Group within Micron's Technology and Products Group to develop signal-integrity (SI) and power-integrity (PI) analysis for HBM interposers, packages, and silicon channels. The role delivers SI/PI sign-off guidance across multiple HBM product generations and helps ensure interface reliability and PDN performance for high-bandwidth AI/ML and HPC applications.

Experience Level

Senior - minimum 5 years of relevant SI/PI experience; preferred 7+ years for advanced responsibilities.

Responsibilities

Primary responsibilities include modeling, analysis, and automation to support HBM build sign-off:

• Perform signal-integrity channel analysis for 2.5D and 3D silicon interposers (frequency- and time-domain metrics: S-parameters, insertion/return loss, PSXT, IL-to-XT, eye diagrams, BER, jitter decomposition).
• Conduct mask‑based timing and time‑domain simulations (SPICE, ADS) for timing budget and jitter analysis.
• Support power-integrity and PDN analysis, including impedance modeling and transient response evaluation.
• Perform electromagnetic extraction and modeling for PCBs, packages, interposers, and other signal/power channels.
• Automate sign-off flows and collaborate with EDA tool vendors to improve simulation accuracy and analysis throughput.
• Contribute to cross-disciplinary SI/PI initiatives and co-design efforts for equalization and interface robustness across product generations.

Requirements

Must-have technical skills and experience required for the role:

• At least 5 years of hands-on experience in SI and PI modeling and analysis.
• Deep understanding of electromagnetic and transmission-line theory, I/O design, and PDN fundamentals.
• Experience with circuit/time-domain simulation tools such as Keysight ADS and Synopsys HSPICE.
• Experience applying AI/ML/LLM tools to improve productivity or analysis efficiency.

Preferred (nice-to-have) qualifications:

• 7+ years of SI/PDN experience, especially for 2.5D/3D advanced packaging (CoWoS, EMIB, interposer-based designs).
• Experience with time-domain analysis (eye, BER, jitter) and frequency-domain characterization (S-parameters, PDN impedance) for high-speed interfaces.
• Experience with high-speed interfaces such as DDR, HBM, UCIe, PCIe, and SERDES.
• Proficiency with industry EDA tools (ANSYS HFSS/SIwave, Cadence PowerSI/PowerDC, and similar).

Education Requirements

Not specified.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.