HBM PYE Product Development Failure Analysis Engineer

Job Title

HBM PYE Product Development Failure Analysis Engineer

Role Summary

Join the HBM Product Development Failure Analysis (PDFA) team to help take next-generation HBM devices from design through qualification into high-volume manufacturing. The role focuses on identifying and resolving component- and system-level failures to improve yield, reliability, and time-to-market.

Experience Level

Mid-level. Typical background: 2+ years in electrical and statistical failure analysis; senior or staff candidates with 7+ years are also considered.

Responsibilities

Core responsibilities include failure characterization, root-cause analysis, and cross-functional issue resolution during new product introduction and production ramp.

• Perform electrical, physical, and statistical failure analysis to identify and characterize defects and failure mechanisms in HBM products.
• Analyze component- and system-level data and apply statistical techniques to resolve root causes.
• Leverage AI/ML and data-analytics tools to improve failure detection, reliability learning, and yield improvement.
• Collaborate with Product, Process, Test, Quality, and Manufacturing Engineering to resolve fabrication, assembly, and test issues.
• Identify process defects, assembly-related failures, and test flow margins through data analysis and characterization.
• Communicate technical findings and recommended corrective actions; drive issue resolution across multi-functional teams.
• Support product qualification, rapid production ramp, and continuous reliability improvement initiatives.

Requirements

Required skills and experience for typical candidates. Education details are listed separately under Education Requirements.

Must-have:

• 2+ years performing electrical and statistical failure analysis to identify and understand failure mechanisms.
• 2+ years applying electrical and physical characterization techniques for semiconductor failure analysis.
• Demonstrated analytical and problem-solving skills, including application of statistical methods and tools for data analysis.
• Experience using AI, machine learning, or data-analytics tools to support engineering analysis and root-cause investigations.
• Strong written and verbal communication skills and ability to collaborate effectively in multi-functional engineering teams.

Nice-to-have:

• 7+ years of experience in electrical and statistical failure analysis and device characterization.
• Experience with statistical analysis software such as JMP.
• Proven ability to influence technical outcomes and lead cross-functional resolution efforts.
• Advanced use of AI/Generative AI tools for large-scale data analysis and failure prediction.

Education Requirements

Minimum: Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field. The posting also allows entry-level candidates with a Master’s degree or equivalent practical experience; senior/staff candidates with extensive experience are considered. Expected coursework or practical training includes VLSI, semiconductor device physics, semiconductor processing, Python programming, and applied statistics.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.