FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering (ASIC Design / Verification / Implementation) - Canada (12 or 16 months)
QualcommJob Title
FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering (ASIC Design / Verification / Implementation) - Canada (12 or 16 months)
Role Summary
Internship on the Low-Power AI, Audio, and Sensors (LPAI/HPASS) team contributing to design, verification, and implementation of ASIC IP and subsystems for mobile, wearable, automotive, and IoT platforms.
Work alongside experienced engineers on RTL design, integration, verification, and tooling to optimize power, area, and performance for always-on and high-performance subsystems.
Experience Level
Entry-level internship. Candidates are expected to be undergraduate students with at least one semester remaining after the internship; typical academic experience, not requiring prior industry employment.
Responsibilities
Hands-on contributions vary by project (Design or Design Verification). Typical responsibilities include:
- Contribute to RTL (Verilog) design and integration of IP into display and subsystem designs.
- Develop and maintain testbenches, assertions, and functional coverage for IP-level verification.
- Participate in test plan development, simulation, and verification closure activities.
- Use CAD tools for linting, power analysis, CDC analysis, and gate-level simulation.
- Perform experiments to optimize designs for power, area, and performance targets.
- Automate flows and tooling using scripting (e.g., Python) to improve methodologies and productivity.
- Debug design and verification issues during the development cycle.
- Work with FPGAs and lab equipment for validation where applicable.
Requirements
Core technical skills and professional behaviors required or strongly preferred.
- Must-have: Knowledge of programming and scripting (C, C++, familiarity with Python), Object-Oriented Programming, and experience with digital circuits and computer hardware concepts (caches, buses, memories, clocking).
- Must-have: Basic competence in teamwork, verbal/written communication, and organization.
- Must-have: Academic project experience or coursework involving digital design and embedded systems concepts.
- Nice-to-have: Experience or coursework with SystemVerilog, UVM, SVTB, or other verification methodologies.
- Nice-to-have: Familiarity with FPGA fundamentals, lab equipment (oscilloscopes), I2S/PCM protocols, DSP / digital filters, or machine-learning mathematics.
- Nice-to-have: Familiarity with version control/perforce and industry CAD/verification tools.
Education Requirements
Currently enrolled in a bachelor’s degree program (Electrical Engineering, Computer Engineering, Engineering Science, Computer Science, or related field). Candidates must have at least one semester remaining after the internship ends and meet availability windows: for 16-month internships, May/June 2027–August/September 2028; for 12-month internships, May/June 2027–May/June 2028. Expected graduation date of November 2028 or later is required. At least one year of academic experience with programming languages such as C, C++, or Python is expected.
About the Company
Company: Qualcomm
Headquarters: San Diego, California, United States
Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.
