FY27 Engineering Intern (6 months)
The Snapdragon Engineering team in Cork, Ireland is seeking interns for Digital, Analog and Embedded Software Design & Verification teams. Interns will work on IP for mobile SoCs including CPU, AI, security, graphics, sensing and high-speed connectivity.
Work involves using current toolsets and flows on advanced FinFET silicon nodes, collaborating with architecture, software, measurement and SoC teams within Qualcomm global locations. Internships may begin as early as January 2027.
Entry-level (internship). Candidates should have completed at least the second year of a Bachelor's degree (or equivalent); Master's students ideally in their second year.
Primary responsibilities for the intern position include hands-on engineering contributions and collaboration with cross-functional teams.
Must-have technical skills and attributes; education requirements are listed separately below.
Enrolled in a Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering or a closely related technical field. Must have completed the second year of a Bachelor’s degree; Master's students ideally in their second year. Relevant coursework may include circuits and electronics, signals and systems, microelectronic devices and circuits, semiconductor devices, feedback systems, digital integrated circuits, digital signal processing, low-power VLSI, semiconductor physics and software programming. Applications from candidates with equivalent practical experience will be considered.
Company: Qualcomm
Headquarters: San Diego, California, United States
Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.
