Micron Technology logo

Fellow, Advanced Packaging

Micron Technology
July 01, 2026
Full-time
On-site
Taichung, TW
Process Engineering Jobs, Level - Senior

Job Title

Fellow, Advanced Packaging

Role Summary

The Fellow, Advanced Packaging is Micron's senior technical authority on advanced packaging technologies. The role owns the 3–10 year technology roadmap, identifies long-term technology inflection points and barriers, advises senior leadership on packaging strategy, and mentors packaging technologists.

Experience Level

Senior β€” requires substantial leadership and technical experience. The posting specifies a minimum of 15 years of technical experience in advanced semiconductor packaging.

Responsibilities

Lead long-range technical direction and solve the most critical packaging challenges:

  • Define and own the 3–10 year advanced packaging technology roadmap and identify inflection points.
  • Anticipate and solve fundamental long-range barriers (interconnect scaling, hybrid bonding yield, thermals, warpage, reliability, defectivity for multi-die complexes).
  • Partner with senior leadership to inform corporate packaging strategy and investment priorities.
  • Drive breakthrough problem solving and incubation of next-generation platform technologies.
  • Generate high-value IP in interconnect architectures, materials, and process innovations.
  • Mentor and develop the next generation of advanced packaging technologists and promote technical rigor.

Requirements

Key must-have technical experience and skills. (Degree requirement summarized separately under Education Requirements.)

  • Minimum 15 years of technical experience in advanced semiconductor packaging technologies.
  • Demonstrated expertise in hybrid bonding, 3D integration, heterogeneous integration, and interconnect scaling.
  • Proven track record taking breakthrough packaging technologies from research into high-volume manufacturing.
  • Experience defining long-term technology roadmaps and informing corporate-level investment strategy for packaging platforms.
  • Demonstrated mentorship and development of technical talent with measurable impact.
  • Ability to bridge fundamental research to production implementation.
  • Nice-to-have: leadership in professional societies or experience as a strategic advisor.

Education Requirements

Ph.D. in Materials Science and Engineering, Electrical Engineering, or a related technical field is required.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

Micron Technology logo

Date Posted: 2026-06-30