Fellow, Advanced Packaging

Job Title

Fellow, Advanced Packaging

Role Summary

Serve as Micron's apex technical authority for advanced semiconductor packaging technologies. Own the 3–10 year technology roadmap, identify inflection points and long-range technical barriers, and lead breakthrough innovations that enable next-generation heterogeneous integration platforms.

Partner with senior leadership to inform corporate packaging strategy, mentor packaging technologists, and drive high-value IP and platform incubation from research to production.

Experience Level

Senior — minimum 15 years of technical experience in advanced semiconductor packaging technologies.

Responsibilities

Key responsibilities include long-range technical leadership, problem solving, and mentoring.

• Define and own a 3–10 year technology roadmap and identify technology inflection points.
• Anticipate and solve long-range fundamental technology barriers (interconnect scaling, hybrid bonding yield, thermals, warpage, reliability, defectivity) in multi-die complexes.
• Partner with senior leadership and cross-functional technologists to inform corporate-level packaging strategy and investment priorities.
• Lead breakthrough problem solving for critical technical roadblocks and incubate next-generation platform technologies.
• Mentor and develop the next generation of advanced packaging engineers and technologists.
• Generate high-value intellectual property in interconnect architectures, materials, and process innovations.

Requirements

Must-have technical skills and demonstrated capabilities. (Education and minimum years of experience are summarized below under Education Requirements.)

• Deep technical expertise in hybrid bonding, 3D integration, heterogeneous integration, and interconnect scaling.
• Proven record of taking packaging technologies from research through high-volume manufacturing.
• Experience defining long-term technology roadmaps and advising on corporate investment strategy.
• Strong ability to translate fundamental research into production implementation.
• Demonstrated ability to mentor and measurably improve engineering capability.
• Nice-to-have: leadership in major professional societies or experience as a strategic advisor.

For assistance with the application process or reasonable accommodations, contact hrsupport_taiwan@micron.com.

Education Requirements

Ph.D. in Materials Science and Engineering, Electrical Engineering, or a related technical field required; minimum 15 years of technical experience in advanced semiconductor packaging technologies.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.