Entry-Level Process Integration Engineer

Job Title

Entry-Level Process Integration Engineer

Role Summary

Serve as a module owner on a 300mm memory fabrication line to investigate failures, stabilize processes, and drive yield and cost improvements for DRAM products. Work with cross-functional teams to qualify new processes, tools, and materials and to support technology transfer.

Experience Level

Entry-level (new graduate / early career). Typical experience: 0–3 years.

Responsibilities

Primary responsibilities include process development, failure analysis, and sustaining manufacturing line stability.

• Conduct root-cause investigations and failure analysis in time-sensitive production environments.
• Design and run DOE to improve process capability and product margin.
• Monitor process trends and maintain line stability; address top detractors to yield and reliability.
• Lead workshops and support technology transfer for next-generation devices, including international assignments.
• Start up, develop, and optimize processes to meet product quality and reliability targets.
• Coordinate and execute evaluations of processes, equipment, and materials; validate and qualify new items for NPI.
• Manage and audit material suppliers against quality, cost, and risk objectives; support internal and external audits.
• Be prepared to work shifted schedules and travel internationally for multi-month technology transfer/training.

Requirements

Must-have technical skills and site capabilities; preferred items listed separately.

• Basic understanding of MOSFET and DRAM operation.
• Knowledge of CMOS processes and electrical/physical characterization methods.
• Familiarity with DOE, SPC methodologies, and JMP software.
• Ability to support SPC/FDC/RMS/APC systems and ensure site-to-site portability.
• Strong analytical and problem-solving skills; able to work under time pressure.
• Effective verbal and written communication; ability to work in cross-functional teams.
• Willingness to travel internationally for extended periods and to work shift schedules as required.
• Preferred: internship or hands-on exposure in a 300mm semiconductor environment and familiarity with memory technologies, transistor/metallization processes, and yield ramp/fab operations.

Education Requirements

Bachelor's degree in Materials Science, Electrical, Electronics, Chemical, or a related engineering field is required (as stated). Internship or academic exposure to semiconductor/memory topics is preferred.

For assistance with the application process or for reasonable accommodations, contact hrsupport_taiwan@micron.com.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.