Engineer, Staff / Manager (Wet Bench/Electroplating)

Job Title

Engineer, Staff / Manager (Wet Bench/Electroplating)

Role Summary

Lead and manage a wafer fabrication manufacturing engineering module focused on wet etch and electroplating processes. The role directs a team of engineers and technicians to ensure process control, yield, equipment availability, and safety in a high-volume semiconductor manufacturing environment.

Experience Level

Senior — typically requires 10+ years of relevant semiconductor wafer fabrication experience.

Responsibilities

Accountable for technical leadership, operational performance, and continuous improvement of wet bench and plating operations.

• Lead and manage wet etch and electroplating manufacturing module and its engineering team.
• Develop and coach engineers and technicians; handle manpower deployment and succession planning.
• Drive output, quality, cost control, equipment uptime, and safety performance.
• Ensure robust process control, stability, and integration across wet etch and plating operations.
• Lead root-cause investigations and implement permanent corrective actions for process, quality, and equipment issues.
• Drive yield improvement, scrap reduction, and defect reduction using data-driven analysis.
• Maintain high equipment availability and reliability for wet benches and plating tools.
• Apply and sustain SPC and statistical analysis to monitor and improve process performance.
• Contribute to continuous improvement programs resolving chronic manufacturing or quality issues.
• Collaborate with Process Integration, Equipment, Quality, and Manufacturing teams.
• Provide technical and operational leadership during crises impacting fab operations.
• Ensure compliance with EHS requirements, quality systems, cleanroom discipline, and wafer fab protocols.

Requirements

Must-have technical skills, domain experience, and leadership abilities for the role.

• Minimum 10 years of relevant experience in semiconductor wafer fabrication, preferably in high-volume manufacturing within an MNC.
• Strong hands-on technical expertise in wet processes, specifically Wet Etch and Electroplating.
• Proven people management experience, including coaching, talent development, and manpower deployment.
• Experience leading root-cause analysis and implementing corrective actions for process and equipment issues.
• Strong understanding of process integration, Statistical Process Control (SPC), yield improvement, and scrap reduction methodologies.
• Knowledge of equipment maintenance strategies, particularly for wet benches and plating tools.
• Hands-on leadership style, strong problem-solving and decision-making capabilities, and ability to work under pressure.
• Excellent communication and cross-functional collaboration skills.
• Familiarity with statistical analysis tools and proficiency with Excel, PowerPoint, and Word.
• Strong commitment to Environmental Health & Safety (EHS), quality systems, and fab compliance.

Education Requirements

Degree preferred: Bachelor's, Master's, or PhD in Computer Science, Electrical/Electronics Engineering, Engineering, Chemistry, Materials Science, Physics, or a related technical discipline. Job combines degree and experience expectations (for example, postings specify combinations such as Bachelor's + experience or advanced degree + fewer years of experience).

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.