Engineer / Senior Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)

Job Title

Engineer / Senior Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)

Role Summary

Technical contributor on the High Bandwidth Memory (HBM) Product Engineering - Media Health team responsible for driving manufacturing execution for next-generation HBM products (DRAM die, interface die, stacked HBM solutions).

Primary responsibilities include manufacturing test flow development and validation, yield improvement, test time reduction, and collaboration with cross-functional teams (Fab, Design, Technology Development, Test Solutions) to meet quality, cost, cycle time, and scale targets.

Experience Level

Senior-level. The posting does not provide an explicit years-of-experience guideline.

Responsibilities

Key technical and cross-functional responsibilities:

• Develop and validate manufacturing test flows for HBM product architectures and process nodes.
• Optimize test coverage and implement test strategies to improve defect detection and reduce test time.
• Drive device- and stack-level yield improvement and resolve manufacturing yield issues related to DRAM, interface, and stacked dies.
• Perform deep circuit debug, root-cause analysis, and resolution for qual and RMA devices.
• Contribute to design-for-test (DFT) strategy and introduce test innovations that reduce cost and cycle time.
• Support design validation activities using CAD tools and simulations where needed.
• Collaborate with Fab, Product Leads, Design Engineering, Technology Development, Test Solutions, and Quality/Reliability teams to execute deliverables.
• Mentor and develop junior engineers and contribute to project management and technical decision-making.
• Leverage automation and AI-powered tools to improve productivity and decision-making.

Requirements

Minimum technical skills and attributes required for success in the role.

• Must-have: Experience with semiconductor devices, circuit design, or product validation in a manufacturing environment.
• Strong problem-solving skills with demonstrated root-cause analysis and resolution experience.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Experience with data analysis, statistics, and scripting (examples: Python, JMP).
• Proven ability to work effectively in team-based, cross-functional projects.
• Clear written and verbal communication skills in English and attention to detail.
• Nice-to-have: Experience with CAD tools and Verilog simulations, DFT strategy development, test solutions engineering, and prior work on HBM or stacked-die products.
• Familiarity with automation and AI-assisted tooling applied to test and manufacturing workflows.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field (as stated in the posting).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.