Engineer, Semi Packaging Engineering

Job Title

Engineer, Semi Packaging Engineering

Role Summary

Engineer responsible for developing advanced semiconductor packaging and module-level solutions from concept through manufacturing for Healthcare, Industrial, Robotics, and Physical AI applications. Works on heterogeneous integration, multi-chip modules, sensor packages and high-density interconnect assemblies.

Collaborates with cross-functional design teams, OSAT/ODM/EMS partners, material suppliers and global manufacturing vendors to drive process development, qualification and volume production readiness.

Experience Level

Mid-level (approx. 2–5 years of relevant industry experience preferred).

Responsibilities

Primary responsibilities include package design, process development, manufacturing support and cross-functional coordination to enable scalable production.

• Design and develop systems-level packaging solutions including heterogeneous integration and multi-chip modules.
• Lead assembly process development and material selection for regulated and industrial applications.
• Own manufacturing engineering tasks: process characterization, yield improvement, CAPA, and design-for-manufacturing requirements.
• Drive PFMEA, DOE, SPC, GR&R and statistical analysis to improve process capability and long-term reliability.
• Partner with OSATs, substrate and PCB suppliers to define package architecture, DFM/DFX requirements and qualification strategies.
• Prepare technical reports and present findings to engineering, operations, suppliers and management.
• Support qualification and transfer for high-volume production and evaluate emerging packaging technologies.

Requirements

Must-have technical skills, industry experience, and working attributes.

• 2 to 5 years of industrial experience in advanced semiconductor packaging, electronics assembly, systems integration or test; experience with OSATs, substrates and EMS partners.
• Strong understanding of packages, modules, heterogeneous integration and materials (substrates, adhesives, underfills, mold compounds, TIMs, interconnects).
• Experience with process development and reliability methodologies: DOE, PFMEA, SPC, 8D, RCA and statistical data analysis.
• Experience using 3D CAD tools (e.g., SolidWorks) for design reviews and modifications.
• Familiarity with thermo-mechanical simulation tools and ability to apply materials/mechanics fundamentals in mechanical design.
• Proven analytical and problem-solving skills and ability to communicate technical concepts clearly to global teams.
• Exposure to regulated manufacturing environments (Medical, Industrial, Robotics) is a distinct advantage.
• Willingness to travel up to 10%.

Education Requirements

Master's degree in engineering (mechanical, materials science, semiconductor engineering, applied physics) or equivalent practical experience. The posting specifies a Master's-level education; equivalent industry experience is acceptable per the source.

About the Company

Company: Analog Devices

Headquarters: Norwood, Massachusetts, USA

Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.