Engineer, Product Engineering - Media Health Reliability, Heterogeneous Integration (High Bandwidth Memory)

Job Title

Engineer, Product Engineering - Media Health Reliability, Heterogeneous Integration (High Bandwidth Memory)

Role Summary

Responsible for developing and executing reliability test flows, qualification plans, and root-cause analysis for High Bandwidth Memory (HBM) products at Fab 10A in Singapore. The role partners with Fab, technology development, design, systems, and global quality teams to ensure product reliability, yield, and manufacturability.

Experience Level

Mid-level. No specific years of experience stated; suitable for engineers with practical experience in semiconductor reliability, test development, or product qualification.

Responsibilities

Key responsibilities include developing test strategies, driving reliability and yield improvements, debugging failures, and coordinating cross-functional qualification and risk management activities.

• Define and develop reliability stress tests, test flows, and qualification test plans covering product reliability aspects.
• Collaborate with global quality to define qualification plans, monitor execution, and resolve gating issues.
• Drive reduction of extrinsic and intrinsic reliability issues (DPM reduction) through optimized manufacturing test flows and strategies.
• Perform root-cause analysis of reliability, qualification, and RMA issues using electrical and physical failure analysis and lead corrective actions.
• Provide recommendations for process conversions and high-volume manufacturing (HVM) to improve yield, cost, and performance for HBM products.
• Manage risks with product leads and prioritize changes to balance innovation with stability.
• Promote and embed AI/automation into reliability workflows to improve productivity and analysis.
• Mentor and develop team members and build project management capability within the team.
• Make technical decisions on risk analysis and project prioritization; coordinate cross-functional teams to deliver product shipments.

Requirements

Core skills and professional behaviors required or strongly preferred.

• Must-have: Strong problem-solving skills and experience in root-cause analysis for semiconductor reliability issues.
• Must-have: Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Must-have: Experience with failure analysis techniques (electrical and physical) and qualification test execution.
• Must-have: Ability to analyze data and use scripting or statistics tools (example: Python, JMP).
• Must-have: Clear technical communication, attention to detail, teamwork, and ownership of tasks.
• Nice-to-have: Experience in semiconductor devices, circuit design, or product validation.
• Nice-to-have: Prior exposure to manufacturing test flow optimization and large-scale qualification programs.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.