Engineer, Product Engineering (Media Health Reliability), Heterogeneous Integration - High Bandwidth Memory

Job Title

Engineer, Product Engineering (Media Health Reliability), Heterogeneous Integration - High Bandwidth Memory

Role Summary

Develop and own product reliability test flows, qualification plans, and failure resolution for High Bandwidth Memory (HBM) within heterogeneous integration. Collaborate with fab, technology, design, systems, and quality teams to improve product reliability, yield, cost, and cycle time.

Experience Level

Mid-level; years of experience not specified.

Responsibilities

Lead technical execution and cross-functional coordination to qualify and ship reliable HBM products.

• Define and develop reliability stress tests, test flows, and qualification plans covering product reliability aspects.
• Partner with Global Quality to plan and manage qualification execution; track progress and resolve gating issues.
• Drive reduction of extrinsic (Time-0, field DPM) and intrinsic reliability failures through optimized manufacturing test flows and strategy.
• Perform root-cause analysis for qualification and RMA issues using electrical and physical failure analysis (EFA/PFA); drive corrective actions.
• Recommend and support process conversions and high-volume manufacturing changes to improve yield, cost, and reliability.
• Assess and manage risks with product managers/leads during process changes and conversions.
• Make technical decisions and prioritize projects; develop project management plans to deliver solutions on schedule.
• Collaborate with Fab, HBM technology development, HBM design, system development, and quality/reliability teams to ship products.
• Identify and scope AI/ML use cases to improve reliability qualification and operations; implement automation and AI-assisted tools.
• Apply machine learning (regression, classification, anomaly detection, clustering) to reliability datasets and mentor team adoption of AI-first workflows.

Requirements

Core technical skills, behaviors, and preferred experience. Degree requirements are listed separately under Education Requirements.

• Must-have: Strong problem-solving methodology and experience identifying root causes and corrective options.
• Must-have: Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Must-have: Experience with data analysis, statistics, and scripting (Python, JMP, or similar) for reliability datasets.
• Must-have: Strong attention to detail, ownership mentality, and clear technical communication skills.
• Must-have: Ability to work effectively in team-based, cross-functional projects and adapt to changing priorities.
• Preferred: Hands-on experience with semiconductor devices, circuit design, product validation, or EFA/PFA tools and workflows.
• Preferred: Applied machine learning or AI experience for anomaly detection, classification, or automation in reliability workflows.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering or a related technical field (for example, Electrical/Computer Engineering, Physics, Materials). The posting specifies Bachelor's or Master's; equivalent-experience language was not provided.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.