Engineer, Product Engineering (Media Health Reliability) - Heterogeneous Integration, High Bandwidth Memory

Job Title

Engineer, Product Engineering (Media Health Reliability) - Heterogeneous Integration, High Bandwidth Memory

Role Summary

Responsible for defining and executing reliability test flows, qualification plans, and failure analysis for High Bandwidth Memory (HBM) products within heterogeneous integration. Works closely with fab, technology development, design, system, and quality teams to reduce DPM, enable process conversions, and drive product reliability improvements.

Experience Level

Mid-level. No explicit years-of-experience specified.

Responsibilities

Accountable for product reliability engineering activities spanning test development, qualification, root-cause analysis, and cross-functional execution.

• Define and develop reliability stress tests, test flows, and test plans covering product reliability aspects.
• Coordinate with Global Quality to define qualification plans, monitor execution, and resolve qualification gating issues.
• Drive reduction of extrinsic and intrinsic reliability failures (Time 0, field DPM) through optimized manufacturing test flows and strategies.
• Perform electrical and physical failure analysis (EFA/PFA) to identify root causes of reliability and RMA issues and drive corrective actions.
• Recommend and support process conversions and high-volume manufacturing activities to improve yield, cost, and reliability of HBM products.
• Manage risk with product managers/leads during process changes and prioritize mitigations.
• Promote technical improvements and innovation to maintain competitive advantage.
• Mentor and develop team members; contribute to project management and technical decision-making.
• Embed AI/automation into reliability workflows to improve productivity and analysis.

Requirements

Technical skills and behaviors required for effective performance in the role.

• Must-have: Strong problem-solving and root-cause analysis skills; clear technical communication and teamwork.
• Must-have: Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Must-have: Exposure to data analysis, statistics, and scripting tools (examples: Python, JMP) for test-data analysis.
• Must-have: Attention to detail, ownership of tasks, and ability to work in cross-functional projects.
• Nice-to-have: Experience with semiconductor devices, circuit design, or product validation.
• Nice-to-have: Prior experience with qualification planning, failure analysis (EFA/PFA), or manufacturing test optimization.

Education Requirements

Bachelor's or Master’s degree in Electrical and Electronics Engineering or a related field (e.g., Electrical Engineering, Electronics, Computer Engineering). No certification requirements or equivalent-experience language specified.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.