Engineer III (Diebond)
NexperiaJob Title
Engineer III (Diebond)
Role Summary
Development Die Bond Engineer responsible for developing, qualifying, and industrializing die attach technologies, processes, materials, and equipment for semiconductor packaging. The role supports product and packaging development and leads technology transfer into high-volume manufacturing.
Works cross-functionally with R&D, Product Development, Process Engineering, Quality, and Operations to ensure scalable, reliable, and cost-effective die bond solutions.
Experience Level
Mid-level. The posting requests 2–5 years of relevant experience in semiconductor assembly or die attach/process engineering; fresh graduates with strong academic record and industrial exposure may be considered for entry-level roles.
Responsibilities
Core responsibilities include development, qualification, and transfer of die bond processes and equipment.
- Develop and qualify new die bond processes, materials, and assembly technologies for semiconductor packages.
- Lead process development activities for new packages and products, including DOE to optimize performance and reliability.
- Evaluate and introduce new die bonding equipment, tools, and process capabilities.
- Support technology transfer from development to mass production and perform process characterization and capability studies.
- Conduct reliability assessments and root cause analysis for development-related process issues.
- Collaborate with suppliers and equipment vendors on emerging technologies and process solutions.
- Prepare technical documentation, process specifications, and qualification reports.
Requirements
Must-have technical skills and experience for the role.
- 2–5 years' experience in semiconductor assembly, die attach/die bond process engineering, or advanced manufacturing.
- Experience designing and executing experiments (DOE) and optimizing process performance.
- Experience with process characterization, capability studies, and reliability testing.
- Proven ability to perform root cause analysis and drive corrective actions in development projects.
- Experience supporting technology transfer and industrialization into mass production.
- Strong technical documentation skills and ability to produce process specifications and qualification reports.
- Ability to work collaboratively with R&D, quality, operations, suppliers, and equipment vendors.
Education Requirements
Bachelor's degree in Electrical Engineering, Electronic Engineering, Mechatronics Engineering, Manufacturing Engineering, Materials Engineering, or a related field. The posting also notes fresh graduates with strong academic achievements and relevant industrial exposure may be considered.
About the Company
Company: Nexperia
Headquarters: Cabuyao, Philippines
Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.
