Engineer, HIG HBM

Job Title

Engineer, HIG HBM

Role Summary

Lead a Product Engineering Media Health team for High Bandwidth Memory (HBM) to develop and execute intrinsic and extrinsic reliability tests across DRAM and interface die and stacked products.

Drive reduction of extrinsic DPM (Time-0 and Field) and intrinsic reliability issues, manage qualification and RMA investigations, and partner with fab and cross-functional teams to implement process conversions and yield/reliability improvements.

Experience Level

Mid-level. Years of experience not specified.

Responsibilities

The role combines technical leadership, people management, and cross-functional program execution to ensure product reliability, quality, cost, and cycle-time targets are met.

• Define and develop reliability stress tests, test flows, and qualification test plans.
• Manage qualification execution with Global Quality and drive resolution of gating issues.
• Reduce extrinsic and intrinsic DPM through optimized manufacturing test flows and strategies.
• Lead root-cause analysis of qualification and RMA failures using electrical and physical failure analysis and drive corrective actions.
• Recommend and support front-end process conversions and HVM activities to improve yield, cost, and reliability.
• Manage risk communication with product leads during process changes and conversions.
• Promote technical innovation and apply AI/automation to reliability workflows.
• Mentor and develop team members and build project management capabilities within the team.
• Collaborate with Fab, Technology Development, Design, System Development, and Quality/Reliability teams.

Requirements

Key technical and professional requirements for successful performance in this role.

• Must-have: Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Must-have: Strong problem-solving and root-cause analysis skills; experience with electrical/physical failure analysis workflows.
• Must-have: Experience with data analysis, statistics, and scripting tools such as Python or JMP.
• Must-have: Strong attention to detail, effective technical communication, and ability to work in cross-functional teams.
• Nice-to-have: Experience in semiconductor devices, circuit design, or product validation.
• Nice-to-have: Prior experience leading reliability or manufacturing test flow development for multi-die or stacked products.
• Adaptability to take on diverse roles in a dynamic engineering environment and ownership of assigned tasks.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.