Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Job Title

Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Role Summary

Develop and scale wafer-level advanced packaging processes (e.g., wafer thinning, backside metal interconnect) for production at Fab 10A. Improve process capability, reduce cost, and enable technology node requirements through process development, equipment/materials evaluation, and cross-functional collaboration.

Experience Level

Mid-level. No specific years of experience stated.

Responsibilities

Accountable for developing, qualifying, and transferring wafer-level packaging processes and ensuring robust manufacturing performance.

• Establish and optimize wafer-level process conditions and technologies (wafer thinning, backside metal interconnect).
• Upgrade process capabilities and identify cost-reduction opportunities.
• Plan and execute process management projects to meet technology node requirements and scaling for next node.
• Evaluate, promote, and plan adoption of new equipment and materials to enhance process capability.
• Set up process parameters across a variety of semiconductor tools and integrate tool/process automation.
• Ensure quality and defense coverage using measurement, inspection, and testing; establish correlations to drive improvements.
• Perform continuous data analysis to implement advanced controls and identify improvement opportunities.
• Collaborate with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality to integrate processes and ensure smooth product transitions.
• Provide Process of Record (POR) and Model of Record (MOR) documentation for transfer to high-volume manufacturing.

Requirements

Key skills and attributes. Listed as must-have versus preferred where clear.

• Must-have: Strong analytical, logical, and critical thinking skills.
• Must-have: Effective communication and ability to collaborate across all levels and functions.
• Must-have: Growth mindset and commitment to continuous learning.
• Preferred / Nice-to-have: Internship or prior experience in the semiconductor industry.
• Preferred / Nice-to-have: Demonstrated leadership and a track record of measurable impact.
• Preferred / Nice-to-have: Familiarity with Micron products and the semiconductor ecosystem.
• Preferred / Nice-to-have: Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
• Preferred / Nice-to-have: Experience with Visual Basic for automation and tool integration.

Education Requirements

Bachelor's or advanced degree in Engineering or Science is required (e.g., Electrical/Mechanical/Materials/Process Engineering, Physics, Chemistry or related technical fields).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.