Engineer, APTD Bonding Process

Job Title

Engineer, APTD Bonding Process

Role Summary

Drive HBM process development and yield improvement for WSS bonding processes within Advanced Package Technology Development (APTD). Support research and development for advanced packaging (chip stacking, 2.5D/3D), act as a technical consultant during project execution, and coordinate materials characterization efforts across global sites.

Experience Level

Entry-level / Early career — minimum 2 years of bonding-related experience required.

Responsibilities

Primary responsibilities include process development, troubleshooting, documentation, and cross-site coordination for advanced bonding and packaging technologies.

• Drive HBM process development and yield improvement in WSS processes.
• Assist R&D for advanced package technologies (chip stacking, 2.5D and 3D integration).
• Support on-site project execution and provide technical decision-making as a consultant.
• Troubleshoot complex process issues; perform root cause analysis and implement corrective actions.
• Prepare technical reports and presentations for internal and external stakeholders.
• Coordinate mechanical and materials characterization activities across global sites (US, Japan, Singapore).
• Recommend test structures and evaluate material properties; lead technical discussions with packaging material suppliers.

Requirements

Must-have technical skills, experience, and behaviors.

• Minimum 2 years of hands-on experience in bonding-related work.
• Solid understanding of WSS/BOND advanced technologies, with experience in one or more of: temporary bonding/debonding (TBDB), hybrid bonding (Cu/dielectric), or fusion/direct wafer bonding.
• Knowledge of bonding mechanisms including surface activation, adhesion physics, interface energy, thermo-compression, and plasma-assisted bonding.
• Fluent communication in both English and Chinese.
• Independent problem solver with an integration mindset and ability to work effectively in teams.
• Nice-to-have: hands-on experience with bonding tools (e.g., SUSS, EVG, TEL) and prior materials characterization/testing experience.

Education Requirements

Master's degree or above (PhD preferred) in Chemistry, Physics, Materials Science, Engineering Science, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.