EMIB-T Substrate Program Integrator

Job Title

EMIB-T Substrate Program Integrator

Role Summary

Join the Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization to lead EMIB-T substrate technology development and qualification. The role focuses on supplier readiness, technical enablement, and cross-functional coordination to move substrate technologies from development into high-volume manufacturing.

Experience Level

Mid-level. Typical experience guidance: Bachelor's +6 years, Master's +4 years, PhD +2 years (per minimum qualifications).

Responsibilities

Accountable for technical leadership and program integration to qualify and scale EMIB-T substrates.

• Lead EMIB-T substrate technology development, qualification, and supplier readiness programs.
• Define and track readiness milestones; manage project schedules and deliverables to support customer demand.
• Drive technical enablement and qualification activities with suppliers and assembly platform partners.
• Coordinate across cross-functional engineering teams (design, process, test, quality) to resolve technical gaps.
• Develop process flows, FMEAs, DOEs, and manufacturing test/characterization plans.
• Lead root-cause analysis and corrective actions for yield and reliability issues.
• Implement statistical process control and yield-improvement initiatives for volume production.

Requirements

Core skills and experience required to perform the role.

• Proven experience managing complex projects and delivering results in technology development and high-volume manufacturing environments.
• Supplier management and technology enablement experience, including driving supplier qualifications and alignment.
• Knowledge of advanced packaging, substrates, or semiconductor assembly manufacturing methods.
• Hands-on experience with process flow development, FMEA, DOE, and formal problem-solving methodologies.
• Proficiency with statistical tools and methods, including SPC for yield improvement.
• Ability to work effectively in high-ambiguity environments and drive cross-functional execution under pressure.

Education Requirements

Bachelor's, Master’s, or PhD in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field. Minimum experience expectations tied to degree: Bachelor's +6 years, Master's +4 years, PhD +2 years.

Nice-to-have

Preferred technical capabilities that will strengthen candidacy.

• Familiarity with characterization techniques such as X-ray, SEM, FTIR, and EDX.
• Prior leadership in global supplier programs or technology transfer to high-volume manufacturing.
• Demonstrated success improving yield and reliability in substrate/assembly processes.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.