Dry Etch Principal Engineer / MTS Lead - Process Development, Advanced NAND

Job Title

Dry Etch Principal Engineer / MTS Lead - Process Development, Advanced NAND

Role Summary

Lead the dry etch process development team for next-generation NAND R&D. Own the process roadmap, drive development and yield improvement of critical etch modules, and coordinate across process integration, wet etch, CVD, diffusion, metals, lithography and CMP.

Collaborate with manufacturing development, equipment and chemical vendors, and integration teams to align priorities and deliver program and yield goals.

Experience Level

Senior - leadership role. Requires demonstrated experience managing process development teams; posting specifies at least 5 years leading a process development team, with broader expectations of 8–15 years depending on educational background.

Responsibilities

Lead projects and people to develop and transfer dry etch processes for NAND products.

• Define strategy and manage projects to develop assigned process technology in Process R&D.
• Coordinate project priorities across multiple customers and cross-functional teams.
• Resolve yield and defect issues related to dry etch and drive continuous process improvements.
• Align regularly with R&D management, Process Integration, and high-volume manufacturing on requirements and timelines.
• Work with Manufacturing Development Engineering to meet R&D product quality and cycle-time goals.
• Engage equipment and chemical vendors to drive equipment/chemistry roadmaps and timely delivery.
• Manage team performance: set goals, mentor staff, conduct evaluations, recruit, and provide conflict resolution.
• Foster operational efficiency by interacting with equipment development teams and suppliers.

Requirements

Must-have technical and leadership qualifications; nice-to-have items listed when available.

• Must-have: Minimum 5 years leading a process development team in semiconductor R&D or high-volume manufacturing.
• Must-have: Comprehensive understanding of plasma dry etch technology and experience with high-aspect-ratio etch development.
• Must-have: Knowledge of hard mask requirements and materials-related etch considerations.
• Must-have: Structured problem-solving skills and experience resolving yield/defect issues.
• Must-have: Strong communication, interpersonal, and relationship-building skills; experience mentoring and managing direct reports.
• Must-have: Experience coordinating with equipment and chemical vendors and with manufacturing integration.
• Must-have: Demonstrated ability to prioritize multiple customer demands and align cross-functional teams.
• Must-have: Experience integrating AI-assisted tools and insights into work to improve efficiency and quality, using sound judgement and complying with standards.
• Nice-to-have: Extensive experience in NAND etch process modules and scaling for next-generation technologies.

Education Requirements

PhD or Master's in Physics, Electrical Engineering, Mechanical Engineering, Materials Science, or Chemical Engineering with at least 8 years of semiconductor industry experience focused on dry etch and managing personnel; or a Bachelor's in those fields with at least 15 years of semiconductor experience focused on dry etch and managing personnel.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.