DMTS SiPh Packaging & Assembly Materials

Job Title

DMTS SiPh Packaging & Assembly Materials

Role Summary

Senior technical lead responsible for defining and qualifying silicon photonics (SiPh) packaging and assembly materials for electro-optical transceiver modules, including 2.5D and 3D co-packaged optics. The role focuses on package reliability, materials selection, packaging design rules, and test methodology for high-data-rate modules.

Experience Level

Level - Senior (DMTS). Role expects approximately 20+ years of relevant industry experience.

Responsibilities

Primary responsibilities include technical leadership, product qualification, and enabling manufacturing and OSAT partnerships.

• Act as GF subject-matter expert for SiPh packaging and assembly materials; respond to internal and external technical inquiries.
• Lead packaging design reviews, materials selection, and FMEA activities for customer packaging concepts.
• Define electrical, photonic, and thermal stress plans and qualification flows for chiplets and packaged modules.
• Establish and enforce packaging design rules and quality expectations for data center, automotive, and communications applications.
• Develop test and measurement methodologies for modules targeting >6.4 Tbps aggregate data rates.
• Drive collaboration and product enablement with OSATs and supply-chain partners for manufacturable solutions.
• Provide tools and analyses for failure/root-cause investigations and quantify associated business impact.
• Promote standardized global qualification processes and site-based quality execution.
• Train and mentor engineers on packaging best practices and design enablement.

Requirements

Must-have technical skills, domain experience, and leadership capabilities.

• Deep expertise in photonic and electronic package architecture and product definition for SiPh advanced packaging (2D, 2.5D, 3D).
• Proven record of photonic and electrical interconnect innovation and commercial product releases with optical/electrical OSATs or partners.
• Experience taking packaged products from development into volume production for data center, automotive, or communications markets.
• Knowledge of packaging reliability drivers, packaging risk factors, materials selection criteria, and qualification metrics.
• Ability to define test strategies and measurement methods for high-bandwidth optical/electrical modules.
• Hands-on experience with packaging integration technologies including fiber attach options (grating/edge couplers, V-groove, MEMS) and 3D electrical interconnects (copper RX, uPillar, hybrid bonding).
• Experience with failure analysis, design of experiments (DOE), and packaging process integration.
• Demonstrated leadership in cross-functional technical programs and capability building (training, design reviews).
• Strong analytical skills for quality issue resolution and financial impact assessment.

Education Requirements

Required: Master's or PhD degree plus approximately 20+ years of relevant industry experience (as listed in the posting). Preferred: background or expertise in materials science, thermal/mechanical simulation, or related technical areas.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.