Distinguished Member of Technical Staff, NAND Advanced Thin Films Process Development

Job Title

Distinguished Member of Technical Staff, NAND Advanced Thin Films Process Development

Role Summary

The Distinguished Member of Technical Staff (DMTS) leads process development for advanced structural and electrical thin films used in NAND, setting technical vision and driving high-impact programs across organizational boundaries.

This role directs breakthrough innovations, influences cross-disciplinary and industry teams, mentors senior technical leaders, and guides roadmap and technology investment decisions that affect product differentiation and yield at scale.

Experience Level

Senior - requires extensive senior technical leadership. The role expects over 20 years of experience in thin film research and development for NAND process technology.

Responsibilities

Primary responsibilities include technical leadership, program ownership, external engagement, and mentoring.

• Define and drive the technical vision for structural and electrical thin film processes across the organization.
• Lead multi-organization programs to deliver process development breakthroughs for NAND scaling.
• Resolve the most challenging technical issues through root-cause analysis and cross-functional guidance.
• Mentor senior technical leaders and influence strategic roadmap and product decisions.
• Represent the company in industry consortia, conferences, and collaborative research projects.
• Develop strategies to reduce cost, improve process efficiency, and increase yield at scale.
• Own and maintain the structural and electrical film process technology roadmap, aligning with business objectives.
• Initiate and lead strategic collaborations with external partners, universities, and research institutes.
• Prepare and present high-impact technical reports, white papers, and patent filings.
• Assess technical risks and prioritize process development investments.

Requirements

Must-have technical skills, experience, and evidence of industry impact.

• Over 20 years of experience in thin film R&D for NAND processes, including diffusion, CVD, dielectric and carbon-based films.
• Mastery of ALD and CVD (plasma and thermal) processes and integration strategies for NAND scaling.
• Deep expertise in reliability modeling, process-device correlation, and advanced failure analysis across technology generations.
• Advanced electrical evaluation experience (leakage, breakdown, capacitance, impedance) and metrology including atom probe tomography, in-line defect mapping, and SPC.
• Proven industry recognition: patents, publications, invited talks, and leadership roles in technical committees or consortia.
• Experience initiating and leading disruptive chemistries, materials, and hardware solutions for next-generation NAND.
• Strong track record in external benchmarking, cross-disciplinary leadership, and influencing industry standards.
• Nice-to-have: hands-on experience with SIMS, XPS, TEM, EELS, ML-assisted image analysis for HAR structures and defect mapping.

Education Requirements

PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field (the posting allows equivalent practical experience in lieu of degree).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.