Director, Process Engineer – Dry Etch

Job Title

Director, Process Engineer 6 Dry Etch

Role Summary

Lead dry etch process engineering for technology development, process capability, and manufacturability across advanced CMOS nodes within Intel's Manufacturing Development and Customer Engineering (MDCE) organization.

Drive development, transfer, optimization, and sustaining of dry etch processes (plasma etch, RIE, ALE, conductor/dielectric etch and related post-etch treatments) to meet foundry technology and high-volume manufacturing targets.

Experience Level

Senior - requires 10+ years of relevant semiconductor industry experience focused on dry etch process development, integration, or HVM support.

Responsibilities

Accountable for delivering robust dry etch solutions from development through high-volume manufacturing.

• Define and execute process experiments; analyze metrology and inline data to drive decisions and corrective actions.
• Develop, optimize, and sustain etch processes to meet CD, profile, selectivity, uniformity, defectivity, and throughput targets.
• Enable process transfer and ramp readiness; support tool qualification, recipe optimization, and excursion response in fabs.
• Collaborate with Integration, Lithography, Thin Films, Cleans, Yield, Defect Metrology, Quality, Reliability, and equipment/supplier teams.
• Partner with suppliers to resolve hardware, chamber matching, and productivity issues.
• Document experiments, best known methods, control plans, and transfer requirements; communicate technical status to stakeholders.
• Operate effectively under schedule pressure and support in-person troubleshooting as required by hybrid work model.

Requirements

Must-have technical skills, experience, and behaviors.

• 10+ years of hands-on experience in dry etch process development, plasma processing, and etch equipment operation.
• Proven track record in process characterization, recipe optimization, and troubleshooting in a manufacturing environment.
• Strong problem-solving using data analysis, DOE, and statistical process control.
• Experience integrating etch processes with downstream modules and interpreting metrology (CD-SEM, profile, film thickness, defect inspection) to drive process decisions.
• Demonstrated collaboration with cross-functional and supplier teams to achieve technology targets.
• Effective verbal and written communication skills; ability to present technical results clearly to varied audiences.
• Willingness to support urgent manufacturing issues and to work on-site as needed for rapid resolution.
• Must consent to and pass an extended background investigation required for this Position of Trust.

Education Requirements

Master's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Materials Science, Physics, Chemistry, or a related technical field is required. A doctoral degree in those fields is preferred. (The posting specifies these degree expectations explicitly.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.