Director, Package Quality and Reliability

Job Title

Director, Package Quality and Reliability

Role Summary

Lead package quality and reliability engineering for new product introductions and high-volume manufacturing. Drive qualification, failure analysis, and risk mitigation across chip-to-package interfaces to ensure robust product ramps for mobile, automotive, data center, and AI/HPC segments.

Experience Level

Senior — requires extensive industry experience. The role specifies 12+ years in semiconductor packaging, reliability, or manufacturing and 5+ years of people management or technical leadership.

Responsibilities

Accountable for package reliability qualification, cross-functional problem solving, and building team capability to deliver manufacturing-ready products.

• Lead execution of package reliability qualification for NPIs and ongoing monitoring in HVM.
• Identify and mitigate reliability risks including chip-to-package interaction, interconnect reliability, thermo-mechanical stress, and material-related failures.
• Develop and improve reliability test coverage, methodologies, and qualification sign-off processes aligned to application requirements.
• Integrate Design for Reliability (DFR) and Design for Manufacturability (DFM) with Package Development Engineering and front-end teams.
• Provide technical leadership for failure analysis and root-cause investigations using structured methodologies (e.g., 8D).
• Lead and develop a team; define KPIs, operating rhythms, training, and resource plans for reliability activities.
• Manage budgets and testing infrastructure, and coordinate with suppliers and OSATs on materials and reliability performance.
• Support data-driven reliability evaluation, predictive analytics, and responsible adoption of AI-enabled tools to improve failure analysis and decision-making.

Requirements

Mandatory technical skills, leadership experience, and industry exposure required for successful performance in this role.

• Minimum 12+ years in semiconductor packaging, reliability, or manufacturing.
• Minimum 5+ years in people management or technical leadership roles.
• Experience in high-volume manufacturing and product ramp execution.
• Strong knowledge of semiconductor packaging technologies and materials.
• Proven experience with reliability test methodologies (temperature cycling, HAST, MSL/preconditioning, board-level reliability) and industry standards such as JEDEC and AEC-Q.
• Working knowledge of failure analysis techniques (cross-sectioning, SAM, X-ray, SEM/EDX) and structured root-cause analysis.
• Understanding of chip-to-package interaction, thermo-mechanical stress, and common reliability failure mechanisms.
• Leadership skills: team development, cross-functional collaboration, structured problem-solving, and clear communication with technical and non-technical stakeholders.
• Ability to manage priorities and deliver in a fast-paced manufacturing environment.

Education Requirements

Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related field is required. Master’s or Ph.D. is preferred. (No certifications specified.)

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.