Director, Package Design Engineering

Job Title

Director, Package Design Engineering

Role Summary

Lead development and qualification of advanced power packaging and interconnect solutions for AI/datacenter power applications, managing R&D, package technology roadmap, and relationships with external OSATs and contract manufacturers.

Own technical direction for power SiP/modules, wafer‑level and flip‑chip methods, and production ramp/quality controls to meet product and reliability targets.

Experience Level

Senior role. Requires extensive leadership and technical experience in semiconductor package development; the posting specifies 15–20 years of relevant experience.

Responsibilities

Accountable for package technology strategy, development, qualification, and transition to production. Key responsibilities include:

• Define package technology roadmap and manage R&D budget and customer adoption programs.
• Lead design and development of packages/interconnects for power applications (power SiP/modules, vertical power stages, power modules, discrete FET packages).
• Drive development in WBG (SiC, GaN), DBC/AMB substrates, advanced interconnects, and wafer‑level/flip‑chip approaches.
• Select, benchmark, qualify materials, processes, OSATs and CMs; establish process specifications.
• Plan and execute DOE with OSAT/CM partners to optimize processes and resolve integration issues.
• Work with product and reliability teams to qualify new packages and ensure production readiness and ramp monitoring.
• Establish production controls, SPC monitoring, and failure-response processes to maintain quality.
• Maintain technical expertise on packaging innovations and contribute to packaging roadmap execution.
• Coordinate cross‑functional responses to customer complaints and quality issues.

Requirements

Must-have technical skills, experience, and competencies:

• 15–20 years of relevant experience in package development with emphasis on power SiP/module, wafer‑level and flip‑chip packaging.
• Proven experience managing OSATs/CMs and leading NPI/qualification for new packages.
• Strong understanding of assembly processes, qualification methods, SPC and statistical analysis tools.
• Experience establishing package design rules, process integration, and production ramp controls.
• Strong analytical, presentation, interpersonal, and cross‑functional communication skills.
• Ability to lead roadmap definition, R&D budgeting, and customer adoption programs.

Education Requirements

Doctorate, Master’s, or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical, Materials Engineering, or a related technical field. (Degrees listed in the posting; equivalent practical experience not explicitly stated.)

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.