Director of SoC Implementation / Physical Design
NXP SemiconductorsJob Title
Director of SoC Implementation / Physical Design
Role Summary
Lead the SoC physical design organization responsible for RTL-to-silicon implementation on advanced nodes. Own program delivery, execution discipline, and cross-functional alignment to achieve tapeout readiness and high-quality silicon.
Manage and grow global physical design teams, drive methodology and automation, and ensure PPA, timing, power, and verification closure for complex SoCs.
Experience Level
Senior - 17+ years of experience in ASIC/SoC physical design.
Responsibilities
Accountable for end-to-end physical design delivery, program execution, team development, and technical strategy.
- Own RTL-to-GDSII implementation: floorplanning, synthesis, place & route, CTS, routing, STA, PDN, PDV and signoff.
- Drive timing, power, IR/EM, and physical verification closure to meet tapeout schedules and quality targets.
- Plan, track, and manage multi-site program schedules, risks, dependencies, and deliveries.
- Build and lead global physical design teams; handle hiring, mentoring, reviews, and performance tracking.
- Define and deploy physical design methodologies, automation, and tool/flow optimizations for advanced nodes.
- Collaborate with architecture, RTL, verification, packaging, EDA vendors and IP providers; support post-silicon bring-up and yield ramp.
Requirements
Must-have skills and experience listed below; preferred items are noted separately.
- 17+ years of ASIC/SoC physical design experience, including leading large-scale SoC programs.
- Deep hands-on expertise in RTL-to-GDSII implementation and signoff flows.
- Strong knowledge of industry EDA tools and flows (Synopsys, Cadence, etc.).
- Proven success with advanced node implementations (e.g., 5nm, 7nm, 16nm).
- Experience driving timing, power, EM/IR closure, PDN design, and physical verification.
- Demonstrated leadership, communication, stakeholder management, and cross-functional coordination skills.
Nice-to-have:
- Automotive or high-reliability SoC experience.
- Expertise in chip-level PDN / EMIR / SI closure.
- Experience leading geographically distributed teams and adoption of AI-driven design/automation.
Education Requirements
Bachelor's or Master's degree in Electrical/Electronics Engineering or a related technical field.
About the Company
Company: NXP Semiconductors
Headquarters: Nijmegen, Netherlands
NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.
