Director of Field Applications Engineering - Europe & APAC

Job Title

Director of Field Applications Engineering — Europe & APAC

Role Summary

Lead and grow the Field Applications Engineering team covering Europe and Asia-Pacific to drive technical adoption, integrations, and design wins for Baya Systems' fabric interconnect silicon IP. Responsible for pre- and post-sales technical support, customer escalations, and regional engineering enablement.

Remote role based in the EU or the UK with up to 30–40% international travel; manages distributed senior FAEs and partners with sales and product teams.

Experience Level

Senior — requires 10+ years in semiconductor, silicon IP, or high-performance networking and 5+ years managing customer-facing engineering teams.

Responsibilities

Key responsibilities include team leadership, customer technical support, and product feedback to drive design wins and roadmap influence.

• Build, lead, and grow a distributed team of senior FAEs across EU and APAC; recruit and onboard regional talent.
• Coach and mentor engineers; set regional goals aligned to corporate objectives.
• Partner with regional sales to develop strategy and secure high-value design wins.
• Own technical delivery and act as escalation point for critical customer issues.
• Oversee customer evaluations, proofs-of-concept, and architectural reviews.
• Deliver technical presentations and product demonstrations to executive customers.
• Collect and funnel customer requirements to R&D and product management; influence roadmap.
• Create enablement materials: application notes, whitepapers, training collateral, and sales support assets.
• Travel internationally (approx. 30–40%) for customer engagements and regional team support.

Requirements

Must-have technical, management, and industry experience required to perform the role.

• Management: 5+ years leading customer-facing engineering teams (FAE or technical support).
• Industry experience: 10+ years in semiconductor, silicon IP, or high-performance networking sectors.
• Technical expertise: deep knowledge of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
• Familiarity with front-end ASIC design, SoC architecture, RTL verification, and common EDA tools (Synopsys, Cadence, Siemens).
• Systems understanding of AI/ML accelerators, data-center architectures, and automotive SoC requirements.
• Exceptional English verbal and written communication; proven cross-cultural experience across Europe and Asia.
• Autonomous, self-motivated style suitable for a fast-paced startup.

Nice-to-have:

• Existing relationships with Tier‑1 semiconductor and system companies in EU or APAC.
• Additional regional languages (e.g., Mandarin, Japanese, Korean, German).
• Prior experience at a venture-backed silicon IP startup.

Education Requirements

Bachelor's degree in Electrical Engineering, Computer Engineering, or a related STEM field required. Preferred: Master's or PhD in Electrical or Computer Engineering. Equivalent practical experience may be considered when applicable.

About the Company

Company: Baya Systems

Headquarters: Santa Clara, CA, USA

Baya Systems is a fast-moving Series B startup focused on accelerating intelligent computing in the emerging chiplet era. They design and license disruptive intellectual property for semiconductor chips and provide software-driven solutions for single-die and multi-die systems. Their contributions aim to simplify the design process for complex System-on-Chip (SoC) and multi-chiplet systems across various markets such as data center, AI, and automotive.