Director, HBM RTL Design and Integration

Job Title

Director, HBM RTL Design and Integration

Role Summary

Lead a team responsible for RTL development and IP integration for HBM logic-die SoCs. Drive technical strategy and execution across architecture, verification, physical design, firmware, and product engineering to deliver multiple product generations.

Focus on engineering execution, manufacturability, and building a high-performing RTL design and integration organization.

Experience Level

Senior — typically 15+ years of relevant SoC design and leadership experience; experience delivering complex tape-outs and managing cross-functional programs.

Responsibilities

Accountable for directing RTL design, SoC integration, team leadership, and cross-functional execution for HBM logic-die programs.

• Lead SoC RTL design and integration: subsystem partitioning, IP integration, and SoC-level convergence.
• Translate architectural and micro-architectural specifications into robust RTL implementations across multiple teams.
• Oversee clocking, reset, power intent, configuration infrastructure, and system-level design correctness.
• Establish design methodologies and best practices to improve quality, reuse, and development efficiency.
• Coordinate with Architecture, Verification, Physical Design, Firmware, and System teams for end-to-end execution.
• Partner with Product Engineering, Test, Probe, Process Integration, Assembly, and Manufacturing to ensure manufacturability.
• Drive trade-offs among performance, power, area, schedule, and risk to optimize product outcomes.
• Recruit, mentor, and scale a high-performing RTL design and integration team.

Requirements

Must-have technical and leadership qualifications first; preferred items listed separately.

Must-have:

• Proven experience leading large-scale SoC design teams delivering complex SoCs to advanced process nodes.
• Deep expertise in RTL design, SoC integration, and full RTL-to-GDS flows, including synthesis, timing, and signoff considerations.
• Experience integrating complex IP subsystems (controllers, NOC, microcontrollers, PHY-adjacent logic, RAS, MBIST, interfaces).
• Proficiency in SystemVerilog and familiarity with scripting and EDA tooling (e.g., Python, TCL).
• Strong leadership, communication, and organizational influence; experience managing cross-functional programs.

Nice-to-have:

• Knowledge of DRAM/HBM systems and JEDEC standards.
• Demonstrated success driving multiple tape-outs and experience building/managing global engineering teams.
• Experience with advanced process nodes (e.g., TSMC) and manufacturability considerations.

Education Requirements

Not specified.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.