Director / DMTS, Process Integration Lead - Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)

Job Title

Director / DMTS, Process Integration Lead - Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)

Role Summary

Lead a technical team that develops and integrates advanced semiconductor packaging technologies from concept through full-scale manufacturing. Drive technology development, process integration, technology transfer, and cross-functional execution for 2.5D/3D, HBM and hybrid bonding platforms.

Experience Level

Senior - requires extensive leadership and technical experience. The role expects approximately 15+ years of relevant industry experience in advanced packaging and integration.

Responsibilities

Accountable for technical leadership, team development, and execution to deliver manufacturable advanced packaging solutions.

• Manage and grow a team responsible for process integration across 2.5D and 3D packaging platforms, advanced interconnects, die-stacking, and HBM implementation.
• Lead development, optimization, and qualification of emerging packaging technologies using DOE, process analysis, and performance validation.
• Improve yield, reliability, and performance via defect analysis, electrical and physical characterization, SPC, and data-driven root-cause investigations.
• Lead technology transfer to manufacturing, including materials qualification, process readiness, baseline characterization, and validation planning.
• Collaborate with design, process, equipment, reliability, test, and manufacturing teams to scale proven methodologies across global organizations.
• Predict and mitigate wafer/die warpage through modeling, material/process controls, and inline metrology validation.
• Define and promote engineering workflows that incorporate automation and AI tools to accelerate development and scale solutions.

Requirements

Key technical skills and leadership experience required to perform the role.

• 15+ years of hands-on experience in advanced packaging technology development, including 2.5D/3D stacking and HBM integration.
• Practical experience with advanced interconnects, TSVs, die stacking, underfill, molding, bonding, and package integration processes.
• Deep experience with hybrid bonding integration (W2W/C2W) and HBM-to-logic integration, including thermal optimization strategies.
• Proven track record leading collaborative technical teams and delivering complex engineering programs to completion.
• Experience in yield analysis, statistical process control, defect reduction, and data-driven process optimization.
• Experience driving technology transfer, materials qualification, process readiness, and validation planning for manufacturing.
• Familiarity with warpage modeling, material characterization, and package reliability qualification.

Education Requirements

Bachelor's degree in Materials Engineering, Chemical Engineering, or a related technical field is required. Master's degree or PhD is preferred. The role specifies significant industry experience (15+ years) in lieu of further academic requirements.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.