Director, Assembly Operations

Job Title

Director, Assembly Operations

Role Summary

Lead high-volume semiconductor IC packaging assembly operations and OSAT partners to convert qualified package technologies and NPI programs into predictable, scalable manufacturing output. Accountable for production output, on-time customer delivery, yield, capacity utilization, quality, and ramp readiness for power and wide-bandgap packaging applications.

Experience Level

Senior — typically requires 12+ years in semiconductor manufacturing/packaging and 5+ years of leadership managing manufacturing or engineering teams.

Responsibilities

Operate and improve global assembly manufacturing to meet production, quality, and ramp objectives. Key responsibilities include:

• Lead global assembly operations and OSAT partners to meet production output, customer commits, and revenue targets.
• Manage capacity, throughput, cycle time, yield, equipment and labor utilization, and operational cost performance.
• Establish production reviews, KPI dashboards, bottleneck resolution, and escalation processes.
• Own yield monitoring, trend analysis, root-cause analysis, and corrective/preventive actions.
• Partner with Package/Product Engineering, Quality, Supply Chain, Planning, and Procurement to ensure manufacturable designs and qualified processes.
• Lead process change management, qualification plans for transfers, equipment changes, and documentation/control of changes.
• Serve as the primary interface for NPI-to-HVM transfers and ramp execution, including BOM/material readiness and capacity planning.
• Manage OSAT/contract manufacturing relationships: qualification, audits, performance management, and capacity expansion.
• Build and develop a high-performing global assembly engineering organization, including talent development and succession planning.

Requirements

Must-have technical and leadership qualifications:

• 12+ years of semiconductor manufacturing, packaging, or assembly operations experience with significant exposure to production ramp, capacity planning, package qualification, and NPI-to-HVM transfers.
• 5+ years of leadership experience managing manufacturing, operations, engineering, or cross-functional teams in semiconductor environments.
• Deep technical expertise in assembly processes (wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT) and experience with power packaging, Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages; experience with SiC/GaN and knowledge of DBC/AMB is valuable.
• Proven track record of NPI-to-HVM ramp execution, including equipment capacity planning, tooling readiness, and production release.
• Experience working with global OSAT partners and outsourced manufacturing ecosystems, including selection, qualification, and ongoing technical management.
• Strong skills in yield analysis, SPC, DOE, statistical tools, process control, and disciplined root-cause problem solving.
• Knowledge of quality systems, change management, and manufacturing qualification methodologies.
• Excellent analytical, organizational, communication, and cross-functional leadership skills.

Nice-to-have:

• Experience with advanced packaging (2.5D/3D, SiP, fan-out, embedded die, heterogeneous integration).
• Familiarity with automotive, AI/datacenter infrastructure power, HPC, and power semiconductor manufacturing requirements.
• Experience managing geographically distributed engineering teams and knowledge of JEDEC/IP C reliability and qualification standards.

Education Requirements

Required: Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Industrial Engineering, Operations Management, Supply Chain, or a related technical discipline. Preferred: Master’s degree or PhD in engineering or a related field. (These degree preferences were stated in the qualifications.)

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.