Director, Advanced Packaging Technology Development

Job Title

Director, Advanced Packaging Technology Development

Role Summary

Leads strategy and technical execution for advanced packaging assembly process development within APTD to enable next‑generation memory products. Manages a global technical organization to deliver scalable, manufacturable, cost‑effective assembly processes and transfer technologies to high‑volume manufacturing.

Experience Level

Senior - requires substantial semiconductor experience (see Requirements for details).

Responsibilities

Key responsibilities include:

• Define and communicate advanced packaging technology strategy and roadmaps.
• Lead process development from concept through qualification and transfer to volume manufacturing.
• Drive innovation across 2.5D/3DIC, hybrid bonding, wafer‑level and panel‑level packaging, and advanced interconnects.
• Establish scalable, manufacturable processes that meet yield, cost, reliability, and cycle‑time targets.
• Partner with Process Integration, Design, Reliability, Manufacturing, Procurement, Quality, and suppliers to solve cross‑functional technical issues.
• Build, mentor, and develop technical leaders; lead succession planning and workforce capability development.
• Set performance metrics, lead continuous improvement initiatives, and report KPIs to senior leadership.
• Promote data‑driven decision making and adoption of AI and advanced analytics for process optimization.

Requirements

Must-have qualifications and skills:

• Minimum 12 years semiconductor industry experience; at least 5 years in advanced packaging technology development.
• Minimum 5 years of leadership experience managing managers or large technical organizations.
• Proven success developing and qualifying advanced packaging technologies from concept to manufacturing transfer.
• Deep expertise in one or more areas: 2.5D/3D packaging, hybrid bonding (D2W/W2W/C2W), HBM and heterogeneous integration, wafer‑level/fan‑out technologies, or advanced assembly processes and materials.
• Strong knowledge of reliability engineering, qualification methodologies, yield improvement, failure analysis, DOE, and statistical process control.
• Advanced data and analytics skills; experience with JMP, Python, R, SQL, or equivalent tools.
• Exceptional stakeholder management, strategic thinking, and executive presentation skills.

Nice-to-have:

• Experience with AI-enabled process optimization and intelligent manufacturing.
• Supplier co‑development and global technology transfer experience.
• Experience planning capital and development-equipment investments for high‑volume packaging platforms (e.g., HBM platforms).

Education Requirements

MS or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Chemistry, Computer Engineering, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.