Digital Design Engineer

Job Title

Digital Design Engineer

Role Summary

Design and verify digital subsystems for co-packaged optics (CPO) products, focusing on RTL implementation, verification, and pre- and post-silicon bring-up. Work within a cross-functional team including architecture, analog/mixed-signal, photonics, and physical design to integrate digital IP into SoC-level designs.

Experience Level

Entry-level to early career. The role expects approximately 1+ years of industry experience in digital RTL design.

Responsibilities

Accountable for implementation, verification, and delivery of digital blocks within the CPO product flow.

• Develop, document, and maintain RTL (SystemVerilog/Verilog) for control logic, register interfaces, link management, and DFT structures.
• Collaborate with architecture, analog/mixed-signal, and photonics teams to define digital interfaces and control schemes for co-packaged optical modules.
• Own micro-architecture specifications, design reviews, and integration of digital IP into the top-level SoC.
• Drive synthesis, timing closure, CDC, lint, and UPF/low-power sign-off with physical design.
• Perform FPGA prototyping and testing to validate functionality and de-risk RTL prior to tape-out.
• Develop and execute UVM-based verification, build reusable verification components, and close functional/code coverage.
• Support DV team on testbench development, debug, and coverage closure.
• Participate in tape-out readiness: ECO planning, gate-level simulation, and post-silicon bring-up support.
• Contribute to design methodology, IP reuse strategy, and quality improvements.

Requirements

Must-have technical skills for the role, plus preferred experience that will accelerate contribution.

Must-have

• 1+ years of experience in digital RTL design using SystemVerilog/Verilog.
• Solid understanding of digital design fundamentals: synchronous design, CDC, FSMs, pipelining, and low-power techniques.
• Hands-on experience with industry EDA tools for synthesis, simulation, CDC analysis, and lint.
• Familiarity with scripting for design automation (Python, TCL, or Perl).
• Strong problem-solving skills and ability to work effectively in cross-functional teams.

Nice-to-have

• Experience with high-speed serial interfaces (SerDes, PCIe, Ethernet, CXL) or optical link control.
• Exposure to silicon photonics, co-packaged optics, or advanced packaging products.
• Experience with ARM-based SoC integration and AMBA protocols (AXI/AHB/APB).
• Prior tape-out experience on advanced process nodes.
• Knowledge of UPF/low-power flows and DFT (scan, MBIST, boundary scan).

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.